Nanoimprint Lithography and the Role of Viscoelasticity in the Generation of Residual Stress in Model Polystyrene Patterns

Published

June 10, 2008

Author(s)

Yifu Ding, Hyun Wook Ro, Jing N. Zhou, Brian C. Okerberg, Jack F. Douglas, Alamgir Karim, Christopher L. Soles

Abstract

Understanding polymer deformation during the nanoimprinting process is key to achieve robust polymer nanostructures. Information regarding the process can be extracted from monitoring the decay of the imprinted polymer patterns during thermal annealing. In this study, both the molecular mass and the imprinting temperature effect on the pattern decay behavior during thermal annealing are systematically investigated. We previously found that the decay rate is the fastest for highly entangled polystyrene (PS) due to the elastic recovery of the polymer caused by the residual stress created during the imprinting process. The present paper demonstrates that the level of this residual stress can be modified through the control of the imprinting temperatures.

Citation

Advanced Functional Materials

Volume

18

Pub Type

Journals

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Keywords

Elastic Recovery, Nanoimprint Lithography, Pattern Stability, Residual Stress

Citation

Ding, Y. , , H. , Zhou, J. , Okerberg, B. , Douglas, J. , Karim, A. and Soles, C. (2008), Nanoimprint Lithography and the Role of Viscoelasticity in the Generation of Residual Stress in Model Polystyrene Patterns, Advanced Functional Materials, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=854115 (Accessed December 8, 2024)