NOTICE: Due to a lapse in annual appropriations, most of this website is not being updated. Learn more.
Form submissions will still be accepted but will not receive responses at this time. Sections of this site for programs using non-appropriated funds (such as NVLAP) or those that are excepted from the shutdown (such as CHIPS and NVD) will continue to be updated.
An official website of the United States government
Here’s how you know
Official websites use .gov
A .gov website belongs to an official government organization in the United States.
Secure .gov websites use HTTPS
A lock (
) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.
Nanoimprint Lithography and the Role of Viscoelasticity in the Generation of Residual Stress in Model Polystyrene Patterns
Published
Author(s)
Yifu Ding, Hyun Wook Ro, Jing N. Zhou, Brian C. Okerberg, Jack F. Douglas, Alamgir Karim, Christopher L. Soles
Abstract
Understanding polymer deformation during the nanoimprinting process is key to achieve robust polymer nanostructures. Information regarding the process can be extracted from monitoring the decay of the imprinted polymer patterns during thermal annealing. In this study, both the molecular mass and the imprinting temperature effect on the pattern decay behavior during thermal annealing are systematically investigated. We previously found that the decay rate is the fastest for highly entangled polystyrene (PS) due to the elastic recovery of the polymer caused by the residual stress created during the imprinting process. The present paper demonstrates that the level of this residual stress can be modified through the control of the imprinting temperatures.
Ding, Y.
, , H.
, Zhou, J.
, Okerberg, B.
, Douglas, J.
, Karim, A.
and Soles, C.
(2008),
Nanoimprint Lithography and the Role of Viscoelasticity in the Generation of Residual Stress in Model Polystyrene Patterns, Advanced Functional Materials, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=854115
(Accessed October 14, 2025)