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Lumped-Parameter Thermal Modeling of an IPEM using Thermal Component Models

Published

Author(s)

J J. Rodriguez, Allen R. Hefner Jr., David W. Berning, M Velez-Reyes, Madelaine H. Hernandez, Jorge Gonz¿lez

Abstract

A thermal model for the CPES IPEM Gen. II is presented. The selected approach is the simulation of the thermal behavior of an experimental IPEM testbed using the 1D finite difference method. An equivalent electrical network representation of the thermal behavior of the IPEM is developed using a 1D finite approach. The SABER circuit simulation tool is used to verify the behavior of our network model and compare its results with previously acquired temperature measurements from the experimental testbed. Both experimental and simulated responses are presented and compared.
Citation
IEEE Transactions on Electronic Packaging

Keywords

circuit simulation, electro-thermal, IGBT, modeling, module package, MOSFET, Power Electronics

Citation

Rodriguez, J. , Hefner Jr., A. , Berning, D. , Velez-Reyes, M. , Hernandez, M. and Gonz¿lez, J. (2004), Lumped-Parameter Thermal Modeling of an IPEM using Thermal Component Models, IEEE Transactions on Electronic Packaging, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=31864 (Accessed July 24, 2024)

Issues

If you have any questions about this publication or are having problems accessing it, please contact reflib@nist.gov.

Created August 14, 2004, Updated October 12, 2021