@article{802786,
  author = {J Rodriguez and Allen Hefner Jr. and David Berning and M Velez-Reyes and Madelaine Hernandez and Jorge Gonz¿lez},
  title = {Lumped-Parameter Thermal Modeling of an IPEM using Thermal Component Models},
  year = {2004},
  month = {2004-08-15 00:08:00},
  publisher = {IEEE Transactions on Electronic Packaging},
  url = {https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=31864},
  language = {en},
}