TY  - JOUR
AU  - J Rodriguez
AU  - Allen Hefner Jr.
AU  - David Berning
AU  - M Velez-Reyes
AU  - Madelaine Hernandez
AU  - Jorge Gonz¿lez
C2  - IEEE Transactions on Electronic Packaging
DA  - 2004-08-15 00:08:00
LA  - en
PB  - IEEE Transactions on Electronic Packaging
PY  - 2004
TI  - Lumped-Parameter Thermal Modeling of an IPEM using Thermal Component Models
UR  - https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=31864
ER  -