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Flip Chip Lamination Approach to Fabricate Top Metal Contacts on Organic-based Devices
Published
Author(s)
Mariona Coll Bau, Oana Jurchescu, Nadine Gergel-Hackett, Curt A. Richter, Christina Hacker
Abstract
Flip Chip Lamination approach to fabricate top metal contacts on organic-based devices ; M.Coll, O.D. Jurchescu, N. Gergel-Hackett, C.A. Richter, C,A, Hacker, American Physical Society (APS), March 2010, Portland, OR, USA (oral)
Coll Bau, M.
, Jurchescu, O.
, Gergel-Hackett, N.
, Richter, C.
and Hacker, C.
(2010),
Flip Chip Lamination Approach to Fabricate Top Metal Contacts on Organic-based Devices
(Accessed April 25, 2024)