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Electrodeposition of gold to conformally fill high-aspect-ratio nanometric silicon grating trenches: a comparison of pulsed and direct current protocols

Published

Author(s)

sami Znati, N Chedid, Houxun Miao, Lei Chen, Han Wen, Eric E. Bennett

Abstract

Filling high-aspect-ratio trenches with gold is a frequent requirement in the fabrication of X-ray optics as well as micro-electronic components and other fabrication processes. Conformal electrodeposition of gold in sub-micron-width silicon trenches with an aspect ratio greater than 35 over a grating area of several square centimeters is challenging and has not been described in the literature previously. A comparison of pulsed plating and constant current plating led to a gold electroplating protocol that reliably filled trenches for such structures.
Citation
Journal of Surface Engineered Materials and Advanced Technology
Volume
05
Issue
04

Keywords

Electrodeposition, High-Aspect-Ratio, Grating, Atomic Layer Deposition

Citation

Znati, S. , Chedid, N. , Miao, H. , Chen, L. , Wen, H. and Bennett, E. (2015), Electrodeposition of gold to conformally fill high-aspect-ratio nanometric silicon grating trenches: a comparison of pulsed and direct current protocols, Journal of Surface Engineered Materials and Advanced Technology, [online], https://doi.org/10.4236/jsemat.2015.54022, https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=918284 (Accessed April 14, 2024)
Created September 30, 2015, Updated October 12, 2021