Huang, H.
, Winchester, K.
, Suvorova, A.
, Liu, Y.
, Hu, X.
, Lawn, B.
, Dell, J.
and Faraone, L.
(2005),
Effect of Deposition Conditions on Mechanical Properties of Low-Temperature PECVD Silicon Nitride Films, Thin Solid Films, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=850126
(Accessed April 18, 2024)
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Effect of Deposition Conditions on Mechanical Properties of Low-Temperature PECVD Silicon Nitride Films
Published
Author(s)
H Huang, K Winchester, A Suvorova, Yiping Liu, X Z. Hu, , J Dell, L Faraone
Abstract
The effect of deposition conditions on characteristic mechanical properties elastic modulus and hardness of low-temperature PECVD silicon nitrides is investigated using nanoindentation. It is found that increase in substrate temperature, increase in plasma power and decrease in chamber gas pressure all result in increases in elastic modulus and hardness. Strong correlations between the mechanical properties and film density are demonstrated. The silicon nitride density in turn is shown to be related to the chemical composition of the films, particularly the silicon/nitrogen ratio.Citation
Thin Solid Films
Volume
A435-436
Pub Type
Journals
Download Paper
Keywords
hardness, modulus, nanoindentation, silicon, silicon nitride, thin films
Citation
Created July 24, 2005, Updated October 12, 2021