Effect of Deposition Conditions on Mechanical Properties of Low-Temperature PECVD Silicon Nitride Films
H Huang, K Winchester, A Suvorova, Yiping Liu, X Z. Hu, Brian R. Lawn, J Dell, L Faraone
The effect of deposition conditions on characteristic mechanical properties elastic modulus and hardness of low-temperature PECVD silicon nitrides is investigated using nanoindentation. It is found that increase in substrate temperature, increase in plasma power and decrease in chamber gas pressure all result in increases in elastic modulus and hardness. Strong correlations between the mechanical properties and film density are demonstrated. The silicon nitride density in turn is shown to be related to the chemical composition of the films, particularly the silicon/nitrogen ratio.
hardness, modulus, nanoindentation, silicon, silicon nitride, thin films
, Winchester, K.
, Suvorova, A.
, Liu, Y.
, Hu, X.
, Lawn, B.
, Dell, J.
and Faraone, L.
Effect of Deposition Conditions on Mechanical Properties of Low-Temperature PECVD Silicon Nitride Films, Thin Solid Films, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=850126
(Accessed November 29, 2023)