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PUBLICATIONS

EDFAS FA TECHNOLOGY ROADMAP DIE-LEVEL ROADMAP COUNCIL (DLRC) POST-ISOLATION DOMAIN TECHNICAL REPORT - JAN 2023

Published

Author(s)

Vinod Narang, Zhang Chuan, David Su, Phil Kaszuba, Steven Herschbein, Alan Street, Eckhard Langer, Martin von Haartman, Yu Zhu, Baohua Niu, Erwin Hendarto, Bryan Tracy, Jochonia Nxumalo, Rik Otte, Keana C. K. Scott

Abstract

Semiconductor technologies are advancing at a rapid pace, with ongoing developments in logic and memory scaling, the introduction of new materials and transistor architectures, and the integration of advanced packaging heterogeneous technologies such as Chiplets, 2.5D, and 3D into mainstream devices. As these technologies evolve, failure analysis (FA) becomes increasingly critical in enabling new innovations. With the complexity of process scaling no longer limited to pure device shrinkage, the challenges of die-level failure analysis have grown significantly. To address these challenges, Die-Level Roadmap Council (DLRC) Post-Isolation Domain Council was established. The objective of the council is to consolidate the challenges and develop a roadmap for addressing them in a comprehensive and strategic manner.
Citation
ASM TECHNICAL BOOKS Electronic Device Failure Analysis Technology Roadmap
Publisher Info
ASM International, Materials Park, OH
Pub Type
Book Chapters

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Keywords

failure analysis, semiconductor, fault isolation, technology gap, research needs
Semiconductors, Metrology and Materials characterization

Citation

Narang, V. , Chuan, Z. , Su, D. , Kaszuba, P. , Herschbein, S. , Street, A. , Langer, E. , von Haartman, M. , Zhu, Y. , Niu, B. , Hendarto, E. , Tracy, B. , Nxumalo, J. , Otte, R. and Scott, K. (2023), EDFAS FA TECHNOLOGY ROADMAP DIE-LEVEL ROADMAP COUNCIL (DLRC) POST-ISOLATION DOMAIN TECHNICAL REPORT - JAN 2023, ASM TECHNICAL BOOKS Electronic Device Failure Analysis Technology Roadmap, ASM International, Materials Park, OH, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=936255 (Accessed April 28, 2024)

Created November 10, 2023, Updated December 3, 2023