@inbook{1221901,
  author = {Vinod Narang and Zhang Chuan and David Su and Phil Kaszuba and Steven Herschbein and Alan Street and Eckhard Langer and Martin von Haartman and Yu Zhu and Baohua Niu and Erwin Hendarto and Bryan Tracy and Jochonia Nxumalo and Rik Otte and Keana C. K. Scott},
  title = {EDFAS FA TECHNOLOGY ROADMAP DIE-LEVEL ROADMAP COUNCIL (DLRC) POST-ISOLATION DOMAIN TECHNICAL REPORT - JAN 2023},
  year = {2023},
  month = {2023-11-10 05:11:00},
  publisher = {ASM TECHNICAL BOOKS Electronic Device Failure Analysis Technology Roadmap, ASM International, Materials Park, OH},
  url = {https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=936255},
  language = {en},
}