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Nicholas Jungwirth, Bryan Bosworth, Meagan Papac, Aaron Hagerstrom, Eric Marksz, Jerome Cheron, Angela Stelson, Florian Bergmann, Ari Feldman, Dylan Williams, Christian Long, Nathan Orloff
We developed an interconnect characterization procedure that first embeds the interconnect into the error boxes of a multiline thru-reflect-line calibration and
Jacob Pawlik, Tomasz Karpisz, Yasaman Kazemipour, Nicholas Derimow, Sarah Evans, Bryan Bosworth, Christian Long, Nathan Orloff, James Booth, Angela Stelson
We demonstrate a glass microwave microfluidic device for determining the permittivity of a wide range of liquid chemicals from 100 MHz to 10 GHz with relatively
Jerome Cheron, Robert Jones, Bryan Bosworth, Jeffrey Jargon, Benjamin Jamroz, Ari Feldman
We report accurate small-signal measurements of heterojunction-bipolar-transistors (HBTs) that are characterized with two on-wafer multiline thru-reflect-line
Nicholas Jungwirth, Bryan Bosworth, Aaron Hagerstrom, Meagan Papac, Eric Marksz, JEROME CHERON, Kassiopeia Smith, Angela Stelson, Ari Feldman, Dylan Williams, Nathan Orloff, Christian Long
State-of-the-art integrated circuits leverage dissimilar materials to optimize system performance. Such heterogeneous integration often involves multiple chips
Nicholas Jungwirth, Bryan Bosworth, Aaron Hagerstrom, Meagan Papac, Eric Marksz, JEROME CHERON, Kassiopeia Smith, Angela Stelson, Ari Feldman, Dylan Williams, Nathan Orloff, Christian Long
Here we test a multimodal model for distributed contactless interconnects by comparing it to 3D full-wave simulations. In comparison to 3D simulations, the