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Florian Bergmann, Meagan Papac, Benjamin Jamroz, Nicholas Jungwirth, Bryan Bosworth, Anna Osella, Tomasz Karpisz, Lucas Enright, Eric Marksz, Angela Stelson, Christian Long, Nathan Orloff, Robert Jones
Modern microchips utilize multilayer stack-ups with many interstitial layers of dielectrics. Optimizing device performance and maximizing yield requires precise
Michelle Crouse, Malgorzata Musial, Jason Widegren, Jacob Pawlik, Bryan Bosworth, Nathan Orloff, Aaron Hagerstrom, Angela Stelson, Robert Lirette
Ultrasonic absorption spectroscopy can probe intermolecular interactions that inform research into chemical engineering and pharmaceutical manufacturing
Nicholas Jungwirth, Bryan Bosworth, Meagan Papac, Aaron Hagerstrom, Eric Marksz, Jerome Cheron, Angela Stelson, Florian Bergmann, Ari Feldman, Dylan Williams, Christian Long, Nathan Orloff
We developed an interconnect characterization procedure that first embeds the interconnect into the error boxes of a multiline thru-reflect-line calibration and
Nathan D. Orloff, Ari D. Feldman, Bryan T. Bosworth, Nicholas R. Jungwirth
The data are measurements of test scattering parameter calibration data for on-wafer measurements from 10 MHz to 110 GHz. Data includes S-parameter data (Ref_Cs_g25_HF_0.s2p, Ref_Rs_g25_HF_0.s2p, Ref