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Nicholas Jungwirth, Bryan Bosworth, Meagan Papac, Aaron Hagerstrom, Eric Marksz, Jerome Cheron, Angela Stelson, Florian Bergmann, Ari Feldman, Dylan Williams, Christian Long, Nathan Orloff
Abstract
We developed an interconnect characterization procedure that first embeds the interconnect into the error boxes of a multiline thru-reflect-line calibration and subsequently de-embeds the interconnect with a multi-tiered calibration. We experimentally validated our method with distributed contactless interconnects in the form of broadside coupled coplanar waveguides as a test case. We find excellent agreement between experiment, full-wave simulations, and a distributed model of contactless interconnects. This work provides a rigorous method to accurately characterize interconnects when conventional approaches are not applicable.
Citation
IEEE Transactions on Microwave Theory and Techniques
Jungwirth, N.
, Bosworth, B.
, Papac, M.
, Hagerstrom, A.
, Marksz, E.
, Cheron, J.
, Stelson, A.
, Bergmann, F.
, Feldman, A.
, Williams, D.
, Long, C.
and Orloff, N.
(2024),
Characterizing interconnects to 325 GHz, IEEE Transactions on Microwave Theory and Techniques, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=936874
(Accessed October 9, 2025)