Patents

Displaying 1 - 4 of 4

Close-up of an emerald green circuit board highlighting the three-dimensional topography of this miniature electronic ecosystem.

Advanced Wafer Bonding for High-Density Semiconductor Integration

NIST Inventors

Eric Stanton and Nima Nader

This invention is a new method for bonding different types of computer wafers called "heterogeneous integration," which allows multiple materials and components to be combined into a single, more advanced electronic device. This invention creates matching pockets in new wafers to fit over existing

Chip Tweezers

This invention is a precision tool, specifically a type of specialized tweezer, for manipulating small samples of various materials, especially fragile microchips. These tweezers are specially designed to safely pick up and handle small, delicate items without touching their top or bottom surfaces

Broadband Light Sensor with Optical Readout

NIST Inventors

Nikolai Klimov , Nathan A Tomlin and Chris Yung

This invention is a new type of light detector called a photonic bolometer. It uses high-heat-resistant carbon nanotubes that can absorb nearly all light and convert it into heat, which is then measured using a special photonic temperature sensor that detects changes in temperature by tracking

Advanced Metal-filling Technology for Enhanced X-Ray Imaging in Medical Diagnostics

NIST Inventors

Daniel Josell and Thomas P. Moffat

These invention comprises special chemical solutions and methods for filling tiny grooves or shapes in materials with metals like gold. The methods ensure the metal fills the space evenly from the bottom up, which is hard to do with regular techniques and leads to smoother, more accurate results.

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Semiconductors

Patents