Suehle, J.
(1998),
Reliability Characterization of Ultra-Thin Film Dielectrics, Proc., 1998 International Conference on Characterization and Metrology for ULSI Technology, Gaithersburg, MD
(Accessed May 9, 2025)
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Reliability Characterization of Ultra-Thin Film Dielectrics
Published
Author(s)
Abstract
The reliability of gate oxides is becoming a critical concern as oxide thickness is scaled below 4 mm in advanced CMOS technologies. Traditional reliability characterization techniques must be modified for very thin gate oxides and soft breakdown. As intrinsic reliability limits are approached by increasing chip temperature and electric fields, it becomes essential to fully understand the physical mechanism responsible for gate oxide wear-out and eventual breakdown. Issues relating to the reliability testing of ultra-thin oxides are discussed with examples.Proceedings Title
Proc., 1998 International Conference on Characterization and Metrology for ULSI Technology
Conference Location
Gaithersburg, MD
Pub Type
Conferences
Keywords
dielectric breakdown, gate oxides, reliability, silicon dioxide
Citation
Issues
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Created December 31, 1998, Updated February 17, 2017