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Microtomography of an integrated circuit interconnect with an electromigration void
Published
Author(s)
Zachary H. Levine, A R. Kalukin, M Kuhn, S P. Frigo, I McNulty, C C. Retsch, Ying-ju Wang, Uwe Arp, Thomas B. Lucatorto, B D. Ravel, Charles S. Tarrio
Citation
Journal of Applied Physics
Volume
87
Pub Type
Journals
Citation
Levine, Z.
, Kalukin, A.
, Kuhn, M.
, Frigo, S.
, McNulty, I.
, Retsch, C.
, Wang, Y.
, Arp, U.
, Lucatorto, T.
, Ravel, B.
and Tarrio, C.
(2000),
Microtomography of an integrated circuit interconnect with an electromigration void, Journal of Applied Physics
(Accessed October 1, 2025)