In this paper we describe the development of a suite of techniques, based on the application of high frequency electromagnetic waves, to probe material and structural changes in integrated circuits under various external perturbations. We discuss how these techniques has been leveraged to study the impact of thermal cycling on the thermo-mechanical reliability of Cu TSV-based interconnects in 3D-ICs. In addition, we demonstrate, with preliminary data, how Scanning Microwave Spectroscopy can be used to detect buried artifacts and characterize metallic contacts.
Proceedings Title: ECS Trasnsaction: Moore-Than-More 2
Conference Dates: May 4-9, 2014
Conference Location: Orlando, FL
Conference Title: 225th Electrochemical Soceity
Pub Type: Conferences
broadband, RF, emerging devices, nanoelectronics, 3D-IC, SMM