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NanoFab Tool: ReynoldsTech Resist Strip Fume Hood
The ReynoldsTech solvent-based chemical hood is used for the removal of photoresist from wafers and photomask substrates. The two chemical baths utilize NMP based chemical 1165 heated at 80 °C to remove resist and clean substrates. The two chemical baths are to be used in sequential order. The first bath of 1165 is a “dirtier” bath and is used to remove the bulk of the photoresist. The second bath is a “cleaner” filtered bath which will clean and remove any stubborn resist left on the substrates. Lastly, the fume hood is equipped with a cascade dump rinse which will thoroughly rinse the substrates.
Specifications/Capabilities
- Two 80 °C heated NMP baths.
- Resist strip and clean.
- Photomask resist strip.
Usage Information
Supported Sample Sizes
- Maximum wafer diameter: 150 mm (6 in).
- Mask sizes supported:
- 127 mm x 127 mm. (5 in.).
- 152.40 mm x 152.40 mm (6 in.).
- Small pieces supported: Yes.
Typical Applications
- Substrate resist strip and clean.
- Photomask resist strip and clean.