Okoro, C.
and Obeng, Y.
(2013),
Impact of Thermal Stability of Isolation Liner on the Electrical Characteristics of TSVs, ECS Transactions (ECST), The Electrochemical Society, Pennington, NJ, [online], https://doi.org/10.1149/1.3700887
(Accessed October 11, 2025)
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Impact of Thermal Stability of Isolation Liner on the Electrical Characteristics of TSVs
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Abstract
This study is focused on understanding the effect of thermal cycling on the signal integrity characteristics of TSV isolation liner (SiO2). The use of radio frequency (RF) signals is found to be a good metrology tool for the detection of discontinuities in the SiO2 isolation liner. Signal losses are found to scale with the attained number of thermal cycles. Atomic force microscopy (AFM) analysis revealed that void formation and growth in the SiO2 isolation liner is the root cause for this observed trend. Therefore the life time of TSVs will be significantly affected by the SiO2 isolation liner, thus, their understanding, engineering and optimization will be essential for prolonged high performance TSVs.Citation
ECS Transactions (ECST)
Volume
45
Issue
3
Publisher Info
The Electrochemical Society, Pennington, NJ
Pub Type
Book Chapters
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Keywords
3D-IC, TSV, Isolation, liner, voids, SiO2, AFM
Citation
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Created July 30, 2013, Updated November 10, 2018