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Ndubuisi George Orji (Fed)
Principal Director - Advanced Packaging - CHIPS R&D
George Orji is the Principal Director for Advanced Packaging within CHIPS R&D Office. In this role, he provides executive and technical leadership and oversight for CHIPS R&D advanced packaging investments. Prior to this role, he was Deputy Director of CHIPS NAPMP, where he led efforts to implement NAPMP’s vision of establishing U.S. leadership in advanced packaging and providing the technology needed for packaging manufacturing in the U.S., and NAPMP’s R&D Investment Portfolio.
Previously, he was a Senior Program Advisor in the CHIPS R&D Office, and before then a Program Analyst in the NIST Program Coordination Office, in the Office of the NIST Director. In that role, he provided technical program and policy analysis, worked with line organizations and other staff offices on planning NIST-level strategies, program evaluation, policy coordination, budget and program initiatives, including early CHIPS Act implementation planning.
He spent almost 15 years in the NIST Labs as a project leader and mechanical engineer in the Physical Measurement, and Manufacturing Engineering Laboratories, where he led projects on nanoscale dimensional metrology, probe-based instrument development, traceability methods and uncertainty analysis, and standards development. He was previously Chair of both the IEEE-IRDS Metrology Focus Team and ITRS Metrology Technical Working Group. He received his PhD in mechanical engineering from the University of North Carolina at Charlotte and is a Senior Member of both IEEE and SPIE.