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NIST Smart Connected Systems Staff Recognized at the 52nd NIST Annual Awards Ceremony

January 1, 2025

On January 15, 2025, NIST held its 52 nd Annual Awards Ceremony in Gaithersburg Maryland, and Boulder, Colorado. At this celebratory event, several NIST Smart

a machine 3d printing a single-family home built out of concrete

Spotlight: Shawn Platt and the Concrete Christmas Tree

December 23, 2024

Some people like plastic Christmas trees; others prefer real wood and needles. This year, NIST is printing a tree out of concrete. The tree is not only festive

Square with rounded edges. Fill of square looks like American flag. Coming off the sides of the square are lines with unfilled circles at end. Words underneath: CHIPS for AMERICA

Biden-Harris Administration Announces CHIPS Incentives Award with Amkor Technology to Bring End-to-End Chip Production to the U.S.

December 20, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded Amkor Technology Arizona, Inc., a subsidiary of Amkor Technology

Biden-Harris Administration Announces CHIPS Incentives Award with Texas Instruments to Expand U.S. Capacity of Current-Generation and Mature-Node Chips

December 20, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded Texas Instruments (TI) up to $1.61 billion in direct funding under

Biden-Harris Administration Announces CHIPS Incentives Award with Samsung Electronics to Solidify U.S. Leadership in Leading-Edge Semiconductor Production

December 20, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded Samsung Electronics (Samsung) up to $4.745 billion in direct

Biden-Harris Administration Announces CHIPS Incentives Award with SK hynix to Advance U.S. Technological Leadership and Expand Capacity of Chips Crucial to the AI Supply Chain

December 19, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded SK hynix up to $458 million in direct funding under the CHIPS

Biden-Harris Administration Announces CHIPS Incentives Awards with GlobalWafers to Support Domestic Production of Silicon Wafers

December 17, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce issued direct funding awards to GlobalWafers America, LLC (GWA) and MEMC

Biden-Harris Administration Announces Preliminary Terms with Bosch to Advance U.S. Supply Chain Resiliency of Crucial Semiconductor Manufacturing Components

December 13, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce and Bosch have signed a non-binding preliminary memorandum of terms (PMT)

Department of Commerce Awards CHIPS Incentives to Micron for Idaho and New York Projects and Announces Preliminary Memorandum of Terms for Virginia DRAM Project to Secure Domestic Supply of Legacy Memory Chips

December 10, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded Micron Technology up to $6.165 billion in direct funding under the

Biden-Harris Administration Announce Preliminary Terms with Coherent, SkyWater, and X-Fab to Advance U.S. Supply Chain Security

December 6, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce signed three separate preliminary memoranda of terms (PMT) under the CHIPS

Biden-Harris Administration Announces CHIPS Incentives Awards with Absolics and Entegris to Support Development of Advanced Packaging Technology and Onshore Material for Leading-Edge Chip Production

December 5, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce has finalized two separate awards under the CHIPS Incentives Program's

Biden-Harris Administration Announces CHIPS Incentives Award with Intel to Advance U.S. Leading-Edge Chip Capacity and Create Tens of Thousands of Jobs

November 26, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded Intel Corporation up to $7.865 billion in direct funding under the

Biden-Harris Administration Announces CHIPS Incentives Awards with BAE Systems, Inc., and Rocket Lab to Expand Production of Chips Critical for U.S. National Security and Space Industry

November 25, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce has finalized two separate awards under the CHIPS Incentives Program’s

CHIPS for America Announces up to $300 million in Funding to Boost U.S. Semiconductor Packaging

November 21, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced

Biden-Harris Administration Announces CHIPS Incentives Award with GlobalFoundries to Strengthen Essential Chip Supply for Key U.S. Industries Including Auto and Defense

November 20, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded GlobalFoundries (GF) up to $1.5 billion in direct funding under

CESMII and NIST MEP Partner to Boost U.S. Manufacturing with Smart Technologies

November 20, 2024

The Clean Energy Smart Manufacturing Innovation Institute (CESMII), part of the Manufacturing USA network, and the National Institute of Standards and

CHIPS for America Announces New Proposed $285 Million Award for CHIPS Manufacturing USA Institute for Digital Twins, Headquartered in North Carolina

November 19, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce and the Semiconductor Research Corporation Manufacturing Consortium

Biden-Harris Administration Announces CHIPS Incentives Award with TSMC Arizona to Secure U.S. Leadership in Advanced Semiconductor Technology

November 15, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded TSMC Arizona Corporation (TSMC Arizona), a subsidiary of Taiwan

Biden-Harris Administration Announces Preliminary Terms with Akash Systems to Support Development and Production of Emerging Semiconductor Technology

November 13, 2024

Today, the Biden-Harris Administration announced that the Department of Commerce and Akash Systems have signed a non-binding preliminary memorandum of terms

An upside down triangle with levels from top to bottom illustrating most preferable to least preferable: reduce, redesign, repair, reuse, mechanical recycling, waste to energy, waste.

NIST & ASTM International Publish Report Highlighting Standards Needs for Circular Textiles

November 8, 2024

103.5 pounds (47 kilograms) – that’s the average amount of textile waste each American produced in 2018. Things like clothing, footwear, sheets, towels, and

Biden-Harris Administration Announces Preliminary Terms with Corning and Powerex to Support U.S. Supply Chain Resiliency

November 8, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce signed two separate preliminary memoranda of terms (PMT) under the CHIPS

NIST Researchers Give Presentation on High-reliability Industrial Wireless Communications at IECON 2024

November 1, 2024

At the 50 th Annual Conference of the IEEE Industrial Electronics Society ( IECON 2024 ), Dr. Richard (Rick) Candell presented a collaborative effort between

Biden-Harris Administration Announces Sunnyvale, CA as Expected Location for Second CHIPS for America R&D Flagship Facility

November 1, 2024

Today, the Department of Commerce and Natcast, the operator of the National Semiconductor Technology Center (NSTC), announced Sunnyvale, California as the

NIST Industrial Wireless Team Supports Kick-off of the ASTM F45.04 Task Group on Mitigation of Interference in Wireless Communication Systems

November 1, 2024

NIST Industrial Wireless Systems Research Lead Dr. Richard (Rick) Candell participated in the kick-off meeting for the ASTM F45.04 System Communication and

NIST Engineers Support Vendor Implementations of STEP to Evolve Digital Manufacturing

November 1, 2024

In September 2024, NIST Engineers Rosemary Astheimer and Allison Barnard Feeney participated in meetings held by the MBx Interoperability Forum - a

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NIST Headquarters
-Creating Helpful Incentives to Produce Semiconductors for America (CHIPS)
--CHIPS Program Office
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---Business Systems Division
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---Office of Reference Materials
----Business and Quality Management Group
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----Data Services Group
----Data Sciences Group
---Biosystems and Biomaterials Division
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----Complex Microbial Systems Group
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----Biosystems and Biomaterials Division - HQ
---Chemical Sciences Division
----Biochemical and Exposure Science Group
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----Optical Measurements Group
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----Gas Sensing Metrology Group
----Inorganic Chemical Metrology Group
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----Chemical Sciences Division - HQ
----Marine Biochemical Sciences Group
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---Biomolecular Measurement Division
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----Bioanalytical Science Group
----Biomolecular Measurement Division - HQ
----Applied Genetics Group
---Applied Chemicals and Materials Division
----Applied Chemicals and Materials Division - HQ
----Thermodynamics Research Center Group
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----Fatigue and Fracture Group
---Materials Science and Engineering Division
----Thermodynamics and Kinetics Group
----Polymers Processing Group
----Mechanical Performance Group
----Polymers and Complex Fluids Group
----Materials Science and Engineering Division - HQ
----Functional Polymers Group
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---Materials Measurement Science Division
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----Surface and Trace Chemical Analysis Group
----Nanomechanical Properties Group
----Nano Materials Research Group
----Materials Structure and Data Group
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----Synchrotron Science Group
----Materials Measurement Science Division - HQ
----Data and AI-Driven Materials Science Group
---Material Measurement Laboratory Office
----The Material Measurement Laboratory Office of Operations Group
----Material Measurement Laboratory - HQ
----Genome-Scale Measurement Group
--NIST Center for Neutron Research
---NIST Center for Neutron Research
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----NIST Center for Neutron Research - HQ
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--Physical Measurement Laboratory
---Microsystems and Nanotechnology Division
----Biophysical and Biomedical Measurement Group
----Microsystems and Nanotechnology - HQ
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----Photonics and Optomechanics Group
---Time and Frequency Division
----Atomic Devices & Instrumentation Group
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----Quantum & Nonlinear Nanophotonics Group
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----Time and Frequency - HQ
---Quantum Physics Division
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---Radiation Physics Division
----Dosimetry Group
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----Radiation Physics - HQ
----Neutron Physics Group
---Sensor Science Division
----Fundamental Thermodynamics Group
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---Applied Physics Division
----Advanced Microwave Photonics Group
----Spin Electronics Group
----Applied Physics - HQ
----Faint Photonics Group
----Quantitative Nanostructure Characterization Group
----Quantum Devices Group
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----Quantum Nanophotonics Group
----Sources and Detectors Group
---Quantum Measurement Division
----Quantum Optics Group
----Mass and Force Group
----Quantum Measurement - HQ
----Laser Cooling and Trapping Group
----Fundamental Electrical Measurements Group
----Applied Electrical Metrology Group
----Atomic Spectroscopy Group
---Quantum Sensors Division
----Device Fabrication Group
----Long Wavelength Sensors and Applications Group
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----Quantum Electronics Group
----Quantum Processing Group
----Quantum Sensors Group
----Quantum Sensors – HQ
----Nanoscale Spin Dynamics Group
----Microfabrication Group
----Spin Electronics Group
----Magnetics Group
---Nanoscale Device Characterization Division
----Atom Scale Device Group
----Nanoscale Device Characterization Division - HQ
----Alternative Computing Group
----Nanoscale Spectroscopy Group
----Advanced Electronics Group
----Nanoscale Processes and Measurements Group
---Physical Measurement Laboratory Office
----Boulder Microfabrication Facility
----Physical Measurement Laboratory- HQ
----PML Information Office
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-Innovation & Industry Services
--Office of Advanced Manufacturing
---Microelectronics Manufacturing Division
----Microelectronics Manufacturing – HQ
----Microelectronics Strategy and Enterprise Group
----Semiconductor Coordination Group
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----Workforce and Equity Development Group
---Office of Advanced Manufacturing
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---Program Operations Division
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----Program Operations - HQ
---Strategy and Planning Division
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----Strategy and Planning – HQ
--Baldrige Performance Excellence Program
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----Director's Office, Baldrige Performance Excellence Program
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--Innovation & Industry Services
---Associate Director for Innovation & Industry Services
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---Advanced Manufacturing Office
----Advanced Manufacturing Office - HQ
---Economic Analysis Office
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---Technology Partnerships Office
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---Technology Innovation Program Office
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--Hollings Manufacturing Extension Partnership Program
---National Platforms Division
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----Network Knowledge Management Group
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---National Programs Division
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---Network Learning and Strategic Competitions Division
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---Outreach and External Affairs Division
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---Regional and State Partnerships Division
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---Internal Operations Division
----Internal Operations – HQ
----Center Operations and Financial Management Group
---Extension Services Division
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-Director's Office
--Director's Office
---Ombuds Office
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----Media Liaison Group
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----Internal Communications and Inquiries Group
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---Program Coordination Office
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---Director's Office
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----Onboarding Group
---Congressional and Legislative Affairs Office
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---Management and Organization Office
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---International and Academic Affairs Office
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