News and Updates

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Horizontal concrete slab is visible in a forest of scaffolding and equipment in a large indoor space.

Champlain Towers South Investigation Team Provides Update to Structural Engineers

April 11, 2025

This outreach will help ensure that the team’s findings and recommendations lead to improvements to codes, standards and practices that can prevent similar

A black and white image of the aluminum alloy under a microscope. Most of the image is light grey, but there are many small black spots that have lines extending out from them like cracks.

Rare Crystal Shape Found to Increase the Strength of 3D-Printed Metal

April 7, 2025

NIST researchers have found special atomic patterns called quasicrystals in 3D-printed aluminum alloys.

MEP Economic Impacts Boost Business and Jobs

March 20, 2025

According to the MEP National Network TM Client Impact Survey, small and medium-sized manufacturers that work with their local Manufacturing Extension

NIST Report to Congress Provides Update on Champlain Towers South Investigation

February 5, 2025

The report notes that the team has completed all experimental work on the physical evidence from the building’s structural elements.

NIST Researcher Describes Data Considerations for Industrial Artificial Intelligence

February 1, 2025

In February 2025, NIST researcher Dr. M. Sharp published the second installment of a 4-part Manufacturing Extension Partnership (MEP) manufacturing innovation

NIST Publishes Electromagnetic Interference Dataset from TIG Arc Welding

February 1, 2025

The NIST Industrial Wireless System team has published a new dataset titled "Electromagnetic Interference Measurements from Tungsten Inert Gas (TIG) Arc Welding

NIST-Led Industrial Wireless Standard IEEE 3388 Passes Important Review Steps

February 1, 2025

For several years, NIST’s Industrial Wireless Systems Project Leader Rick Candell and his team have led the working group developing the draft IEEE 3388

NIST Researchers Showcase Successful mmWave Industrial IoT Measurement Capability

February 1, 2025

On February 5, 2025, NIST researchers presented the results of their highly successful Innovation in Measurement Science (IMS) project, “The World’s Best IIoT

2025 MBE & QIF Summit Update

January 20, 2025 - April 6, 2025

The 2025 MBE & QIF Summit event is returning to MxD (Manufacturing x Digital) headquarters in Chicago, IL, April 15 - 17, 2025. The 2025 event will bring the

Square with rounded edges. Fill of square looks like American flag. Coming off the sides of the square are lines with unfilled circles at end. Words underneath: CHIPS for AMERICA

U.S. Department of Commerce Announces CHIPS Incentives Awards with Corning, Edwards Vacuum, and Infinera to Increase Domestic Production Capacity of Chips and Equipment Critical for U.S. Technological Leadership

January 17, 2025

Today, the U.S. Department of Commerce announced it finalized three separate awards under the CHIPS Incentives Program’s Funding Opportunity for Commercial

U.S. Department of Commerce Announces $1.4 Billion in Final Awards to Support the Next Generation of U.S. Semiconductor Advanced Packaging

January 16, 2025

Today, the U.S. Department of Commerce has announced that CHIPS National Advanced Packaging Manufacturing Program (NAPMP) has finalized $1.4 billion in award

Department of Commerce Finalizes Long-Term Partnership with Natcast to Operate the National Semiconductor Technology Center

January 16, 2025

Today, the U.S. Department of Commerce announced the National Institute of Standards and Technology (NIST) has awarded Natcast up to $6.3 billion to operate the

Department of Commerce Announces Preliminary Terms with Analog Devices, Coherent Corp., Intelligent Epitaxy Technology, Inc. and Sumika Semiconductor Materials Texas Inc., to Strengthen U.S. Semiconductor Leadership

January 16, 2025

Today, the U.S. Department of Commerce announced the signing of four separate non-binding preliminary memoranda of terms (PMT) under the CHIPS and Science Act

U.S. Department of Commerce Announces Preliminary Terms with MACOM to Help Strengthen Supply Chain Resilience for U.S. Defense and Telecommunications Industries

January 14, 2025

Today, the U.S. Department of Commerce signed a non-binding preliminary memorandum of terms (PMT) with MACOM Technology Solutions Inc. (“MACOM”) to provide up

Biden-Harris Administration Announces CHIPS Incentives Award with HP to Support Domestic Manufacturing of Next-Generation Technologies and “Lab-to-Fab” Ecosystem

January 13, 2025

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded HPI Federal LLC up to $53 million in direct funding under the

A scientist wearing safety glasses stands in front of a monitor in her lab.

NIST Database Can Help Increase Recycling of Textiles and Clothing

January 7, 2025

Picture this: You have a bag of heavily used clothes that can no longer be donated taking up space in your closet, so you drop it off at your local recycling

Department of Commerce Announces CHIPS Incentives Award with Hemlock Semiconductor to Help Secure U.S. Production Capacity of Semiconductor-Grade Polysilicon

January 7, 2025

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded Hemlock Semiconductor (HSC) up to $325 million in direct funding

NIST Smart Connected Systems Staff Recognized at the 52nd NIST Annual Awards Ceremony

January 1, 2025

On January 15, 2025, NIST held its 52 nd Annual Awards Ceremony in Gaithersburg Maryland, and Boulder, Colorado. At this celebratory event, several NIST Smart

a machine 3d printing a single-family home built out of concrete

Spotlight: Shawn Platt and the Concrete Christmas Tree

December 23, 2024

Some people like plastic Christmas trees; others prefer real wood and needles. This year, NIST is printing a tree out of concrete. The tree is not only festive

Biden-Harris Administration Announces CHIPS Incentives Award with Amkor Technology to Bring End-to-End Chip Production to the U.S.

December 20, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded Amkor Technology Arizona, Inc., a subsidiary of Amkor Technology

Biden-Harris Administration Announces CHIPS Incentives Award with Texas Instruments to Expand U.S. Capacity of Current-Generation and Mature-Node Chips

December 20, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded Texas Instruments (TI) up to $1.61 billion in direct funding under

Biden-Harris Administration Announces CHIPS Incentives Award with Samsung Electronics to Solidify U.S. Leadership in Leading-Edge Semiconductor Production

December 20, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded Samsung Electronics (Samsung) up to $4.745 billion in direct

Biden-Harris Administration Announces CHIPS Incentives Award with SK hynix to Advance U.S. Technological Leadership and Expand Capacity of Chips Crucial to the AI Supply Chain

December 19, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded SK hynix up to $458 million in direct funding under the CHIPS

Biden-Harris Administration Announces CHIPS Incentives Awards with GlobalWafers to Support Domestic Production of Silicon Wafers

December 17, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce issued direct funding awards to GlobalWafers America, LLC (GWA) and MEMC

Biden-Harris Administration Announces Preliminary Terms with Bosch to Advance U.S. Supply Chain Resiliency of Crucial Semiconductor Manufacturing Components

December 13, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce and Bosch have signed a non-binding preliminary memorandum of terms (PMT)

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