News and Updates

Displaying 1 - 25 of 843

Square with rounded edges. Fill of square looks like American flag. Coming off the sides of the square are lines with unfilled circles at end. Words underneath: CHIPS for AMERICA

Todd Younkin Steps Down from Department of Commerce’s Industrial Advisory Committee

May 7, 2025

The NIST CHIPS R&D Program announces that Todd Younkin, CEO of Semiconductor Research Corporation and Executive Director of the SMART USA Institute, stepped

MBE & QIF Summit 2025

April 25, 2025

The 2025 MBE Summit was hosted at MxD headquarters in Chicago, IL, April 15 - 18. NIST's Rosemary Astheimer organized technical content in conjunction with the

NIST Engineer Leads the 2025 MBE & QIF Summit

April 14, 2025

In April 2025, MxD hosted the 2025 Model-Based Enterprise (MBE) & Quality Information Framework (QIF) Summit at its Chicago, Illinois headquarters, in

Horizontal concrete slab is visible in a forest of scaffolding and equipment in a large indoor space.

Champlain Towers South Investigation Team Provides Update to Structural Engineers

April 11, 2025

This outreach will help ensure that the team’s findings and recommendations lead to improvements to codes, standards and practices that can prevent similar

A black and white image of the aluminum alloy under a microscope. Most of the image is light grey, but there are many small black spots that have lines extending out from them like cracks.

Rare Crystal Shape Found to Increase the Strength of 3D-Printed Metal

April 7, 2025

NIST researchers have found special atomic patterns called quasicrystals in 3D-printed aluminum alloys.

NIST Researcher Leads Workshop on Whole Community Preparedness at Smart Cities Conference

April 1, 2025

On 16 April 2025, NIST researcher Michael Dunaway and colleagues organized and led a workshop on “Whole Community Preparedness for Smart, Connected Cities” at

NIST Researcher Gives Keynote Presentation at Avnu Alliance Plenary

April 1, 2025

NIST researcher Rick Candell delivered a keynote presentation at the plenary session of the Avnu Alliance Plugfest in Malaga, Spain on April 8, 2025. The Avnu

MEP Economic Impacts Boost Business and Jobs

March 20, 2025

According to the MEP National Network TM Client Impact Survey, small and medium-sized manufacturers that work with their local Manufacturing Extension

NIST Report to Congress Provides Update on Champlain Towers South Investigation

February 5, 2025

The report notes that the team has completed all experimental work on the physical evidence from the building’s structural elements.

NIST Researcher Describes Data Considerations for Industrial Artificial Intelligence

February 1, 2025

In February 2025, NIST researcher Dr. M. Sharp published the second installment of a 4-part Manufacturing Extension Partnership (MEP) manufacturing innovation

NIST Publishes Electromagnetic Interference Dataset from TIG Arc Welding

February 1, 2025

The NIST Industrial Wireless System team has published a new dataset titled "Electromagnetic Interference Measurements from Tungsten Inert Gas (TIG) Arc Welding

NIST-Led Industrial Wireless Standard IEEE 3388 Passes Important Review Steps

February 1, 2025

For several years, NIST’s Industrial Wireless Systems Project Leader Rick Candell and his team have led the working group developing the draft IEEE 3388

NIST Researchers Showcase Successful mmWave Industrial IoT Measurement Capability

February 1, 2025

On February 5, 2025, NIST researchers presented the results of their highly successful Innovation in Measurement Science (IMS) project, “The World’s Best IIoT

2025 MBE & QIF Summit Update

January 20, 2025 - April 6, 2025

The 2025 MBE & QIF Summit event is returning to MxD (Manufacturing x Digital) headquarters in Chicago, IL, April 15 - 17, 2025. The 2025 event will bring the

U.S. Department of Commerce Announces CHIPS Incentives Awards with Corning, Edwards Vacuum, and Infinera to Increase Domestic Production Capacity of Chips and Equipment Critical for U.S. Technological Leadership

January 17, 2025

Today, the U.S. Department of Commerce announced it finalized three separate awards under the CHIPS Incentives Program’s Funding Opportunity for Commercial

Department of Commerce Finalizes Long-Term Partnership with Natcast to Operate the National Semiconductor Technology Center

January 16, 2025

Today, the U.S. Department of Commerce announced the National Institute of Standards and Technology (NIST) has awarded Natcast up to $6.3 billion to operate the

Department of Commerce Announces Preliminary Terms with Analog Devices, Coherent Corp., Intelligent Epitaxy Technology, Inc. and Sumika Semiconductor Materials Texas Inc., to Strengthen U.S. Semiconductor Leadership

January 16, 2025

Today, the U.S. Department of Commerce announced the signing of four separate non-binding preliminary memoranda of terms (PMT) under the CHIPS and Science Act

U.S. Department of Commerce Announces $1.4 Billion in Final Awards to Support the Next Generation of U.S. Semiconductor Advanced Packaging

January 16, 2025

Today, the U.S. Department of Commerce has announced that CHIPS National Advanced Packaging Manufacturing Program (NAPMP) has finalized $1.4 billion in award

U.S. Department of Commerce Announces Preliminary Terms with MACOM to Help Strengthen Supply Chain Resilience for U.S. Defense and Telecommunications Industries

January 14, 2025

Today, the U.S. Department of Commerce signed a non-binding preliminary memorandum of terms (PMT) with MACOM Technology Solutions Inc. (“MACOM”) to provide up

Biden-Harris Administration Announces CHIPS Incentives Award with HP to Support Domestic Manufacturing of Next-Generation Technologies and “Lab-to-Fab” Ecosystem

January 13, 2025

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded HPI Federal LLC up to $53 million in direct funding under the

Department of Commerce Announces CHIPS Incentives Award with Hemlock Semiconductor to Help Secure U.S. Production Capacity of Semiconductor-Grade Polysilicon

January 7, 2025

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded Hemlock Semiconductor (HSC) up to $325 million in direct funding

A scientist wearing safety glasses stands in front of a monitor in her lab.

Biden-Harris Administration Announces CHIPS Incentives Award with Amkor Technology to Bring End-to-End Chip Production to the U.S.

December 20, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded Amkor Technology Arizona, Inc., a subsidiary of Amkor Technology

Manufacturing

News and Updates

Todd Younkin Steps Down from Department of Commerce’s Industrial Advisory Committee

MBE & QIF Summit 2025

NIST Engineer Leads the 2025 MBE & QIF Summit

Champlain Towers South Investigation Team Provides Update to Structural Engineers

Rare Crystal Shape Found to Increase the Strength of 3D-Printed Metal

NIST Researcher Leads Workshop on Whole Community Preparedness at Smart Cities Conference

NIST Researcher Gives Keynote Presentation at Avnu Alliance Plenary

MEP Economic Impacts Boost Business and Jobs

NIST Report to Congress Provides Update on Champlain Towers South Investigation

NIST Researcher Describes Data Considerations for Industrial Artificial Intelligence

NIST Publishes Electromagnetic Interference Dataset from TIG Arc Welding

NIST-Led Industrial Wireless Standard IEEE 3388 Passes Important Review Steps

NIST Researchers Showcase Successful mmWave Industrial IoT Measurement Capability

2025 MBE & QIF Summit Update

U.S. Department of Commerce Announces CHIPS Incentives Awards with Corning, Edwards Vacuum, and Infinera to Increase Domestic Production Capacity of Chips and Equipment Critical for U.S. Technological Leadership

Department of Commerce Finalizes Long-Term Partnership with Natcast to Operate the National Semiconductor Technology Center

Department of Commerce Announces Preliminary Terms with Analog Devices, Coherent Corp., Intelligent Epitaxy Technology, Inc. and Sumika Semiconductor Materials Texas Inc., to Strengthen U.S. Semiconductor Leadership

U.S. Department of Commerce Announces $1.4 Billion in Final Awards to Support the Next Generation of U.S. Semiconductor Advanced Packaging

U.S. Department of Commerce Announces Preliminary Terms with MACOM to Help Strengthen Supply Chain Resilience for U.S. Defense and Telecommunications Industries

Biden-Harris Administration Announces CHIPS Incentives Award with HP to Support Domestic Manufacturing of Next-Generation Technologies and “Lab-to-Fab” Ecosystem

Department of Commerce Announces CHIPS Incentives Award with Hemlock Semiconductor to Help Secure U.S. Production Capacity of Semiconductor-Grade Polysilicon

NIST Database Can Help Increase Recycling of Textiles and Clothing

NIST Smart Connected Systems Staff Recognized at the 52nd NIST Annual Awards Ceremony

Spotlight: Shawn Platt and the Concrete Christmas Tree

Biden-Harris Administration Announces CHIPS Incentives Award with Amkor Technology to Bring End-to-End Chip Production to the U.S.

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