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The 2025 MBE Summit was hosted at MxD headquarters in Chicago, IL, April 15 - 18. NIST's Rosemary Astheimer organized technical content in conjunction with the
This outreach will help ensure that the team’s findings and recommendations lead to improvements to codes, standards and practices that can prevent similar
NIST researcher Rick Candell delivered a keynote presentation at the plenary session of the Avnu Alliance Plugfest in Malaga, Spain on April 8, 2025. The Avnu
On 16 April 2025, NIST researcher Michael Dunaway and colleagues organized and led a workshop on “Whole Community Preparedness for Smart, Connected Cities” at
In February 2025, NIST researcher Dr. M. Sharp published the second installment of a 4-part Manufacturing Extension Partnership (MEP) manufacturing innovation
The NIST Industrial Wireless System team has published a new dataset titled "Electromagnetic Interference Measurements from Tungsten Inert Gas (TIG) Arc Welding
For several years, NIST’s Industrial Wireless Systems Project Leader Rick Candell and his team have led the working group developing the draft IEEE 3388
On February 5, 2025, NIST researchers presented the results of their highly successful Innovation in Measurement Science (IMS) project, “The World’s Best IIoT
The 2025 MBE & QIF Summit event is returning to MxD (Manufacturing x Digital) headquarters in Chicago, IL, April 15 - 17, 2025. The 2025 event will bring the
Today, the U.S. Department of Commerce announced it finalized three separate awards under the CHIPS Incentives Program’s Funding Opportunity for Commercial
Today, the U.S. Department of Commerce announced the signing of four separate non-binding preliminary memoranda of terms (PMT) under the CHIPS and Science Act
Today, the U.S. Department of Commerce has announced that CHIPS National Advanced Packaging Manufacturing Program (NAPMP) has finalized $1.4 billion in award
Today, the U.S. Department of Commerce announced the National Institute of Standards and Technology (NIST) has awarded Natcast up to $6.3 billion to operate the
Today, the U.S. Department of Commerce signed a non-binding preliminary memorandum of terms (PMT) with MACOM Technology Solutions Inc. (“MACOM”) to provide up
Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded HPI Federal LLC up to $53 million in direct funding under the
Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded Hemlock Semiconductor (HSC) up to $325 million in direct funding
Picture this: You have a bag of heavily used clothes that can no longer be donated taking up space in your closet, so you drop it off at your local recycling
On January 15, 2025, NIST held its 52 nd Annual Awards Ceremony in Gaithersburg Maryland, and Boulder, Colorado. At this celebratory event, several NIST Smart
Some people like plastic Christmas trees; others prefer real wood and needles. This year, NIST is printing a tree out of concrete. The tree is not only festive
Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded Amkor Technology Arizona, Inc., a subsidiary of Amkor Technology
Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded Texas Instruments (TI) up to $1.61 billion in direct funding under