News and Updates

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Biden-Harris Administration Announces Preliminary Terms with Bosch to Advance U.S. Supply Chain Resiliency of Crucial Semiconductor Manufacturing Components

December 13, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce and Bosch have signed a non-binding preliminary memorandum of terms (PMT)

Department of Commerce Awards CHIPS Incentives to Micron for Idaho and New York Projects and Announces Preliminary Memorandum of Terms for Virginia DRAM Project to Secure Domestic Supply of Legacy Memory Chips

December 10, 2024

CHIPS Award Will Support Micron’s 20-year Manufacturing Vision to Expand Leading-Edge DRAM Production in Idaho and New York CHIPS PMT Would Support Expansion of

Biden-Harris Administration Announce Preliminary Terms with Coherent, SkyWater, and X-Fab to Advance U.S. Supply Chain Security

December 6, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce signed three separate preliminary memoranda of terms (PMT) under the CHIPS

Biden-Harris Administration Announces CHIPS Incentives Awards with Absolics and Entegris to Support Development of Advanced Packaging Technology and Onshore Material for Leading-Edge Chip Production

December 5, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce has finalized two separate awards under the CHIPS Incentives Program's

Biden-Harris Administration Announces CHIPS Incentives Award with Intel to Advance U.S. Leading-Edge Chip Capacity and Create Tens of Thousands of Jobs

November 26, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded Intel Corporation up to $7.865 billion in direct funding under the

Biden-Harris Administration Announces CHIPS Incentives Awards with BAE Systems, Inc., and Rocket Lab to Expand Production of Chips Critical for U.S. National Security and Space Industry

November 25, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce has finalized two separate awards under the CHIPS Incentives Program’s

CHIPS for America Announces up to $300 million in Funding to Boost U.S. Semiconductor Packaging

November 21, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced

CESMII and NIST MEP Partner to Boost U.S. Manufacturing with Smart Technologies

November 20, 2024

The Clean Energy Smart Manufacturing Innovation Institute (CESMII), part of the Manufacturing USA network, and the National Institute of Standards and

Biden-Harris Administration Announces CHIPS Incentives Award with GlobalFoundries to Strengthen Essential Chip Supply for Key U.S. Industries Including Auto and Defense

November 20, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded GlobalFoundries (GF) up to $1.5 billion in direct funding under

CHIPS for America Announces New Proposed $285 Million Award for CHIPS Manufacturing USA Institute for Digital Twins, Headquartered in North Carolina

November 19, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce and the Semiconductor Research Corporation Manufacturing Consortium

Biden-Harris Administration Announces CHIPS Incentives Award with TSMC Arizona to Secure U.S. Leadership in Advanced Semiconductor Technology

November 15, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded TSMC Arizona Corporation (TSMC Arizona), a subsidiary of Taiwan

Biden-Harris Administration Announces Preliminary Terms with Akash Systems to Support Development and Production of Emerging Semiconductor Technology

November 13, 2024

Today, the Biden-Harris Administration announced that the Department of Commerce and Akash Systems have signed a non-binding preliminary memorandum of terms

Biden-Harris Administration Announces Preliminary Terms with Corning and Powerex to Support U.S. Supply Chain Resiliency

November 8, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce signed two separate preliminary memoranda of terms (PMT) under the CHIPS

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NIST & ASTM International Publish Report Highlighting Standards Needs for Circular Textiles

November 8, 2024

103.5 pounds (47 kilograms) – that’s the average amount of textile waste each American produced in 2018. Things like clothing, footwear, sheets, towels, and

NIST Engineer Presents at Women in Manufacturing Summit

November 1, 2024

In October 2024, NIST Researcher Rosemary Astheimer presented at the 2024 Women in Manufacturing Summit in Boston, Massachusetts. The Summit, attended by over 2

NIST Research Leader Featured at IECON 2024 Industry Forum

November 1, 2024

At the 50 th Annual Conference of the IEEE Industrial Electronics Society ( IECON 2024 ) in Chicago, Illinois, Dr. Richard (Rick) Candell, Principal

NIST Researchers Give Presentation on High-reliability Industrial Wireless Communications at IECON 2024

November 1, 2024

At the 50 th Annual Conference of the IEEE Industrial Electronics Society ( IECON 2024 ), Dr. Richard (Rick) Candell presented a collaborative effort between

Biden-Harris Administration Announces Sunnyvale, CA as Expected Location for Second CHIPS for America R&D Flagship Facility

November 1, 2024

Today, the Department of Commerce and Natcast, the operator of the National Semiconductor Technology Center (NSTC), announced Sunnyvale, California as the

NIST Industrial Wireless Team Supports Kick-off of the ASTM F45.04 Task Group on Mitigation of Interference in Wireless Communication Systems

November 1, 2024

NIST Industrial Wireless Systems Research Lead Dr. Richard (Rick) Candell participated in the kick-off meeting for the ASTM F45.04 System Communication and

NIST Engineers Support Vendor Implementations of STEP to Evolve Digital Manufacturing

November 1, 2024

In September 2024, NIST Engineers Rosemary Astheimer and Allison Barnard Feeney participated in meetings held by the MBx Interoperability Forum - a

Biden-Harris Administration Announces NY CREATES’ Albany NanoTech Complex as the first CHIPS for America R&D Flagship Facility and Planned Site for the estimated $825 Million CHIPS for America EUV Accelerator

October 31, 2024

Today, the Department of Commerce and Natcast, the operator of the National Semiconductor Technology Center (NSTC), announced the expected location for the

Biden-Harris Administration Opens $100 million Competition to Accelerate R&D and AI Technologies for Sustainable Semiconductor Materials

October 30, 2024

Today, the Biden-Harris Administration announced a Notice of Funding Opportunity (NOFO) for activities that will use cutting-edge artificial intelligence (AI)

Biden-Harris Administration Announces Preliminary Terms with Hemlock Semiconductor to Significantly Expand U.S. Production Capacity of Semiconductor-Grade Polysilicon

October 21, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce and Hemlock Semiconductor (HSC) have signed a non-binding preliminary

Biden-Harris Administration Opens Funding Competition for Up to $1.6 Billion to Accelerate U.S. Semiconductor Advanced Packaging Technologies

October 18, 2024

Today, the Biden-Harris Administration issued a Notice of Funding Opportunity (NOFO) funded by the CHIPS and Science Act to enable the United States

Biden-Harris Administration Announces Preliminary Terms with Infinera to Support Development of Semiconductor Technology Important for Communications and National Security

October 17, 2024

Today, the Biden-Harris Administration announced that the Department of Commerce and Infinera have signed a non-binding preliminary memorandum of terms (PMT) to

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