The Bachur & Associates LS-200FSX Photoresist Stabilization System provides deep-ultraviolet (DUV) flood exposure and resist curing. The system strengthens photoresist to prevent damage from processes such as ion implantation and aggressive etching that might otherwise damage the photoresist. The tool has a DUV light source, an auto-timer, and a high precision hotplate which allows automatic processing on substrates ranging from 200 mm diameter wafers down to small pieces.
NanoFab Tool: Bachur & Associates LS-200FSX Photoresist Stabilization System
Specifications/Capabilities
- Adjustable light intensity levels: > 10 mW / cm2 at 254 nm wavelength.
- Beam uniformity over 200 mm diameter: ± 5%.
- Vacuum hot plate: 50 °C to 200 °C with temperature uniformity ± 2 °C across 200 mm diameter working area.
- Timed and test mode exposure.
- Built-in and external intensity meters.
- Nitrogen purging.
Usage Information
Supported Sample Sizes
- Maximum wafer diameter: 200 mm (8 in).
- Small pieces supported: Yes.
- Maximum substrate thickness: 4 mm.
Typical Applications
- Flood exposure of photoresist.
- Resist hardening for better endurance during etching, implantation, and ion milling.
Created May 07, 2014, Updated April 28, 2017