The Bachur & Associates LS-200FSX Photoresist Stabilization System provides deep-ultraviolet (DUV) flood exposure and resist curing. The system strengthens photoresist to prevent damage from processes such as ion implantation and aggressive etching that might otherwise damage the photoresist. The tool has a DUV light source, an auto-timer, and a high precision hotplate which allows automatic processing on substrates ranging from 200 mm diameter wafers down to small pieces.
NanoFab Tool: Bachur & Associates LS-200FSX Photoresist Stabilization System
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Specifications/Capabilities
- Adjustable light intensity levels: > 10 mW / cm2 at 254 nm wavelength.
- Beam uniformity over 200 mm diameter: ± 5%.
- Vacuum hot plate: 50 °C to 200 °C with temperature uniformity ± 2 °C across 200 mm diameter working area.
- Timed and test mode exposure.
- Built-in and external intensity meters.
- Nitrogen purging.
Usage Information
Supported Sample Sizes
- Maximum wafer diameter: 200 mm (8 in).
- Small pieces supported: Yes.
- Maximum substrate thickness: 4 mm.
Typical Applications
- Flood exposure of photoresist.
- Resist hardening for better endurance during etching, implantation, and ion milling.
Details
NEMO Name:
Bachur DUV
Location:
Building 215 Rm. A105 (Cleanroom)
Campus:
Gaithersburg
Hours of Operation
Cleanroom hours
Tool Reservation Rules
Tool Reservation Rules
- Minimum Reservation Time: 30 minutes.
- Maximum Reservation Time: 4 hours.
- Adjacent Reservations Permitted: No.
- Cancelation Policy: Reservations must be canceled at least 12 hours before the scheduled start time.
Hourly Rate
Standard Cost:
Included in the cleanroom access rate.
Training Rates
Individual Cost:
$155
Group Cost:
$78
Training Time
Depends on user experience and process requirements; typically 30 minutes.
Contact
-
Contact:
Liya Yu, Primary Engineer
Marc Cangemi, Backup Engineer
Email: nanofab_litho@nist.gov
Phone: 1-877-NANO-US1
Address: 100 Bureau Drive, Stop 6201
Gaithersburg, MD 20899-6201
Created May 07, 2014, Updated April 28, 2017