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Advanced packaging involves increasingly challenging requirements for heterogeneous integration and chiplet packaging. Needs such as fine pitch interconnects (
New Standard Reference Materials (SRMs) consisting of activated carbon sorbent materials and flue gas desulfurization (FGD) gypsum are being developed to
The NIST program seeks to facilitate the commercialization of the ceramics additive manufacturing via the concurrent development of: New measurement approaches
This project aims to enable use of metal additive manufacturing (AM) in fatigue and fracture critical applications via two main thrusts: Develop appropriate
The development of new materials for diverse applications relating to the development of new energy sources, more efficient homes, autos, and aircraft, and the
The Fluid Characterization Group is developing the advanced fluid characterization laboratory information management system (AFC-LIMS) to support several
The objective for Advanced IC Interconnects is to provide measurement standards and advanced measurement methods supporting metrology needs of the semiconductor
The Surface and Trace Chemical Analysis Group conducts both applied and fundamental research into the development, characterization, and analysis of various
The Chemical Sciences Division supports the characterization of new, diverse, and technological critical materials. The constant evolution of material science
Using methods such as electronic structure (such as density functional theory, tight-binding, quantum Monte Carlo), force-field, machine-learning and quantum
An integrated computational materials engineering (ICME) approach is employed to link experimental and computational models across a variety of time and length
Electron, ion and photon-based microanalysis methods, instrumentation and protocols are developed to advance measurement science towards the elemental and
Advanced experimental and theoretical methods are developed to increase the accuracy and precision of X-ray line energies and information derived from X-ray
We develop methods to evaluate the mechanical behavior of micro- and mesoscale metal alloys to fracture, and Micro Electro Mechanical Systems (MEMS) materials
The semiconductor industry continues to push for smaller features, more integration, and increased yield. New photoresist chemistries and advances in extreme
Advanced microscopy and spectroscopy techniques are used in this project to study the chemical and physical properties of particles contained in complex
We have advanced a spectral analysis method to characterize overlapping spectral data based on two-dimensional correlation spectroscopy (2DCOS). Using advanced
The exponential growth in the power electronics market requires efficient devices based on wide bandgap (WBG) semiconductors. The yield of power devices is
This effort uses advanced fluid flow visualization and flow diagnostic techniques to better-understand the role of fluid dynamics in our Safety & Security focus
Ambient and atmospheric pressure mass spectrometry platforms provide sample collection, transport, and ionization for vapor, aerosol, and liquid samples
ZnO nanowires (NWs) are grown on bulk copper by chemical vapor deposition. Photoluminescence (PL) microscopy revealed band gap emission at 380 nm and a more
Atmospheric aerosol particles often have compositions and shapes that cannot be described as a single material phase within a simplified geometric form such as
Transmission electron imaging and diffraction in an SEM are powerful tools that can be utilized in settings ranging from academia to small business, to