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X-Ray and Neutron Porosimetry as Powerful Methodologies for Determining Structural Characteristics of Porous Low-k Thin Films

Published

Author(s)

Hae-Jeong Lee, B D. Vogt, Christopher L. Soles, Da-Wei Liu, Barry J. Bauer, Wen-Li Wu, Eric K. Lin, Gwi-Gwon Kang, Min-Jin Ko

Abstract

Methylsilsesquioxane based porous low-k dielectric films with varying porogen loading have been characterized using X-ray and neutron porosimetry to determine their pore size distribution, average density, wall density, porosity, density profiles, and porosity profiles. The porosity and the average pore size of the sample with 45 % porogen were 52 % and 23 in radius, respectively. Pore size was consistent with that from small angle neutron scattering measurements. The wall density was found to be independent of the porogen content and it appeared that the porogen was 100% effective in generating pores. In addition, effects of plasma treatment, ashing and etching processes on the structural characteristics, especially the depth dependence of porosity have been investigated.
Proceedings Title
IEEE International Interconnect Technology Conference|7th| International Interconnect Technology|IEEE
Conference Dates
June 1, 2004
Conference Title
Proceedings of the IEEE International Interconnect Technology Conference

Keywords

film density, porosity, porous low-k dielectric material, small-angle neutron scattering, wall density, x-ray porosimetry, x-ray reflectivity

Citation

Lee, H. , Vogt, B. , Soles, C. , Liu, D. , Bauer, B. , Wu, W. , Lin, E. , Kang, G. and Ko, M. (2004), X-Ray and Neutron Porosimetry as Powerful Methodologies for Determining Structural Characteristics of Porous Low-k Thin Films, IEEE International Interconnect Technology Conference|7th| International Interconnect Technology|IEEE (Accessed May 27, 2024)

Issues

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Created June 1, 2004, Updated February 17, 2017