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Wire Bonding to Advanced Copper, Low-K Integrated Circuits, the Metal/Dielectric Stacks, and Materials Considerations

Published

Author(s)

George G. Harman, Charles Johnson
Citation
IEEE Trans. on Components and Packaging Technologies
Volume
25
Issue
4

Citation

Harman, G. and Johnson, C. (2002), Wire Bonding to Advanced Copper, Low-K Integrated Circuits, the Metal/Dielectric Stacks, and Materials Considerations, IEEE Trans. on Components and Packaging Technologies, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=31291 (Accessed April 24, 2024)
Created December 14, 2002, Updated October 12, 2021