Harman, G.
and Johnson, C.
(2002),
Wire Bonding to Advanced Copper, Low-K Integrated Circuits, the Metal/Dielectric Stacks, and Materials Considerations, IEEE Trans. on Components and Packaging Technologies, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=31291
(Accessed May 10, 2024)
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Wire Bonding to Advanced Copper, Low-K Integrated Circuits, the Metal/Dielectric Stacks, and Materials Considerations
Published
Author(s)
, Charles Johnson
Citation
IEEE Trans. on Components and Packaging Technologies
Volume
25
Issue
4
Pub Type
Journals
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If you have any questions about this publication or are having problems accessing it, please contact reflib@nist.gov.
Created December 14, 2002, Updated October 12, 2021