@article{760116,
  author = {George Harman and Charles Johnson},
  title = {Wire Bonding to Advanced Copper, Low-K Integrated Circuits, the Metal/Dielectric Stacks, and Materials Considerations},
  year = {2002},
  number = {25},
  month = {2002-12-15 00:12:00},
  publisher = {IEEE Trans. on Components and Packaging Technologies},
  url = {https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=31291},
  language = {en},
}