TY  - JOUR
AU  - George Harman
AU  - Charles Johnson
C2  - IEEE Trans. on Components and Packaging Technologies
DA  - 2002-12-15 00:12:00
LA  - en
M1  - 25
PB  - IEEE Trans. on Components and Packaging Technologies
PY  - 2002
TI  - Wire Bonding to Advanced Copper, Low-K Integrated Circuits, the Metal/Dielectric Stacks, and Materials Considerations
UR  - https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=31291
ER  -