Liew, L.
, Moreland, J.
and Gerginov, V.
(2006),
Wafer-Level Fabrication and Filling of Cesium-Vapor Resonance Cells for Chip-Scale Atomic Devices, Proceedings of 20th Eurosensors Conference, Goteborg, 1, SW, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=32413
(Accessed April 20, 2024)
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Wafer-Level Fabrication and Filling of Cesium-Vapor Resonance Cells for Chip-Scale Atomic Devices
Published
Author(s)
, , V Gerginov
Abstract
We describe the wafer-level fabrication of cesium vapor cells by evaporation and photolysis of cesium azide for chip-scale atomic devices. The advantage is that, unlike existing cell-fabrication methods which require fluid handling devices for filling individual and separately fabricated cells, here the filling step itself is done by thin-film deposition and thus integrated monolithically with the rest of the fabrication process.Proceedings Title
Proceedings of 20th Eurosensors Conference
Conference Dates
September 17-20, 2006
Conference Location
Goteborg, 1, SW
Pub Type
Conferences
Download Paper
Keywords
atomic clock, cell, cesium
Citation
Created October 15, 2006, Updated October 15, 2021