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Wafer-Level Fabrication and Filling of Cesium-Vapor Resonance Cells for Chip-Scale Atomic Devices

Published

Author(s)

Li-Anne Liew, John M. Moreland, V Gerginov

Abstract

We describe the wafer-level fabrication of cesium vapor cells by evaporation and photolysis of cesium azide for chip-scale atomic devices. The advantage is that, unlike existing cell-fabrication methods which require fluid handling devices for filling individual and separately fabricated cells, here the filling step itself is done by thin-film deposition and thus integrated monolithically with the rest of the fabrication process.
Proceedings Title
Proceedings of 20th Eurosensors Conference
Conference Dates
September 17-20, 2006
Conference Location
Goteborg, 1, SW

Keywords

atomic clock, cell, cesium

Citation

Liew, L. , Moreland, J. and Gerginov, V. (2006), Wafer-Level Fabrication and Filling of Cesium-Vapor Resonance Cells for Chip-Scale Atomic Devices, Proceedings of 20th Eurosensors Conference, Goteborg, 1, SW, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=32413 (Accessed April 18, 2024)
Created October 15, 2006, Updated October 15, 2021