Koyama, R.
and Buehler, M.
(1979),
A wafer chuck for use between -196 and 350 degrees C:, , National Institute of Standards and Technology, Gaithersburg, MD, [online], https://doi.org/10.6028/NBS.SP.400-55 (Accessed May 21, 2026)
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A wafer chuck for use between -196 and 350 degrees C:
Published
Author(s)
,
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- NBS SP 400-55
Report Number
NBS SP 400-55
Pub Type
NIST Pubs
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Created January 1, 1979, Updated May 19, 2023