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Thermal Interactions Between Electromigration Test Structures
Published
Author(s)
Harry A. Schafft, John Albers
Proceedings Title
Proc., IEEE International Conference on Microelectronic Test Structures
Conference Dates
February 22-23, 1988
Conference Location
Long Beach, CA, USA
Pub Type
Conferences
Citation
Schafft, H.
and Albers, J.
(1988),
Thermal Interactions Between Electromigration Test Structures, Proc., IEEE International Conference on Microelectronic Test Structures, Long Beach, CA, USA
(Accessed June 8, 2023)