Schafft, H.
and Albers, J.
(1988),
Thermal Interactions Between Electromigration Test Structures, Proc., IEEE International Conference on Microelectronic Test Structures, Long Beach, CA, USA
(Accessed February 24, 2026)
Official websites use .gov
A .gov website belongs to an official government organization in the United States.
Secure .gov websites use HTTPS
A lock (
) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.
Thermal Interactions Between Electromigration Test Structures
Published
Author(s)
,
Proceedings Title
Proc., IEEE International Conference on Microelectronic Test Structures
Conference Dates
February 22-23, 1988
Conference Location
Long Beach, CA, USA
Pub Type
Conferences
Citation
Issues
If you have any questions about this publication or are having problems accessing it, please contact [email protected].
Created December 30, 1988, Updated October 12, 2021