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Thermal Interactions Between Electromigration Test Structures

Published

Author(s)

Harry A. Schafft, John Albers
Proceedings Title
Proc., IEEE International Conference on Microelectronic Test Structures
Conference Dates
February 22-23, 1988
Conference Location
Long Beach, CA, USA

Citation

Schafft, H. and Albers, J. (1988), Thermal Interactions Between Electromigration Test Structures, Proc., IEEE International Conference on Microelectronic Test Structures, Long Beach, CA, USA (Accessed May 24, 2024)

Issues

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Created December 30, 1988, Updated October 12, 2021