A synchrotron beamline for extreme-ultraviolet photoresist testing

Published

September 30, 2011

Author(s)

Charles S. Tarrio, Steven E. Grantham, Shannon B. Hill, Nadir S. Faradzhev, Lee J. Richter, Chester Knurek, Thomas B. Lucatorto

Abstract

Before being used in an extreme-ultraviolet (EUV) scanner, photoresists must first be evaluated for sensitivity and tested to ensure that they will not contaminate the scanner optics. The new NIST facility described here provides data on the contamination potential of the outgas products of a candidate resist by simultaneously irradiating a multilayer optic and a nearby resist-coated wafer with EUV radiation. The facility can also be used without changing its configuration to provide accurate sensitivity measurements. Detailed, real-time information on the rate of contamination growth is given by a unique, in situ imaging ellipsometer. We will describe the optical layout, mechanical design, and capabilities of the beamline, finally presenting experimental examples of its capabilities.

Citation

Review of Scientific Instruments

Volume

82

Pub Type

Journals

Download Paper

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Keywords

extreme ultraviolet, vacuum, contamination, outgassing, EUV optics, photoresist extreme ultraviolet, vacuum, contamination, outgassing, EUV optics, photoresist extreme ultraviolet, vacuum, contamination, outgassing, EUV optics, photoresist contamination, EUV optics, extreme ultraviolet, outgassing, photoresist, vacuum

Optical physics and communications

Citation

Tarrio, C. , Grantham, S. , Hill, S. , Faradzhev, N. , Richter, L. , Knurek, C. and Lucatorto, T. (2011), A synchrotron beamline for extreme-ultraviolet photoresist testing, Review of Scientific Instruments, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=908231 (Accessed May 28, 2022)