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Superconducting Integrated Circuit Fabrication Process Utilizing Low Temperature ECR-Based PECVD SiO2 Dielectric Films

Published

Author(s)

J. E. Sauvageau, P. A. Booi, M. W. Cromar, Samuel Benz, Charles J. Burroughs, Jonathan A. Koch
Citation
IEEE Transactions on Applied Superconductivity
Volume
5
Issue
2

Citation

Sauvageau, J. , Booi, P. , Cromar, M. , Benz, S. , Burroughs, C. and Koch, J. (1995), Superconducting Integrated Circuit Fabrication Process Utilizing Low Temperature ECR-Based PECVD SiO<sub>2</sub> Dielectric Films, IEEE Transactions on Applied Superconductivity (Accessed July 16, 2024)

Issues

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Created May 31, 1995, Updated October 12, 2021