Structural Characterization of Porous Low-k SiOC Thin Films Using Novel X-Ray Porosimetry
H W. Kim, Wen-Li Wu, Barry J. Bauer, Eric K. Lin, J Y. Kim, Y H. Kim, V. J. Lee
A novel x-ray porosimetry measurement is used to characterize the structure and properties of porous low-k dielectric films after varying process conditions. We determine the film thickness, density depth profile, average density, wall density, and porosity. When the deposition temperature increases, the porosity and wall density increase. The low porosity of films deposited at 200 degrees C results in good mechanical properties with a dielectric constant as low as 2.5.
Proceedings of the IEEE International Interconnect Technology Conference
average density, carbon incorporated film (SiOC), density profile, deposition temperature, porosity, porous CVD low-k dielectric, wall density, x-ray porosimetry
, Wu, W.
, Bauer, B.
, Lin, E.
, Kim, J.
, Kim, Y.
and Lee, V.
Structural Characterization of Porous Low-k SiOC Thin Films Using Novel X-Ray Porosimetry, Proceedings of the IEEE International Interconnect Technology Conference, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=851998
(Accessed September 23, 2023)