A new test specimen has been developed for micro-scale tensile strength measurements, allowing direct assessment of surface effects on strength. Specimens were formed by deep reactive ion etching, tested with instrumented indentation, and test results interpreted using finite element analyses. Fracture strengths reached 3 GPa; fracture initiated at processing-induced flaws.
Citation: Journal of Microelectromechanical Systems
Pub Type: Journals
Finite element analysis (FEA), fracture strength, microelectromechanical systems (MEMS), single-crystal silicon, Weibull statistics