Allen, R.
, Cassard, J.
, Baylies, W.
, Read, D.
, Quinn, G.
, DelRio, F.
, Turner, K.
, Bernasch, M.
and Bagdahn, J.
(2008),
A Standard Method for Measuring Wafer Bond Strength for MEMS Applications, Proc. ECS: E11 - Semiconductor Wafer Bonding 10: Science, Technology, and Applications, Honolulu, HI, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=33132
(Accessed October 6, 2024)
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A Standard Method for Measuring Wafer Bond Strength for MEMS Applications
Published
Author(s)
, , Winthrop A. Baylies, , , , Kevin T. Turner, Michael Bernasch, Joerg Bagdahn
Abstract
A round robin, to provide precision and bias data for SEMI standard MS5-1107, Test Method for Wafer Bond Strength Measurements Using Micro-Chevron Test Structures, in underway. The precision and bias data, combined with experience in applying the test instructions included in MS5-1107, will provide the basis for an updated version of MS5. Measurements at the pilot lab have been completed and the round robin is on-going at six additional laboratories.Volume
16
Issue
8
Conference Dates
October 12-18, 2008
Conference Location
Honolulu, HI
Conference Title
Proc. ECS: E11 - Semiconductor Wafer Bonding 10: Science, Technology, and Applications
Pub Type
Conferences
Download Paper
Keywords
micro-chevron, wafer bond strength measurement, SEMI MS5
Citation
Issues
If you have any questions about this publication or are having problems accessing it, please contact reflib@nist.gov.
Created December 23, 2008, Updated February 19, 2017