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Search Publications by: Polette Centellas (Fed)

Displaying 1 - 2 of 2

Advanced Metrology Suite for Linking Residual Stress to Fundamental Properties of Thermoset Packaging Materials

June 26, 2025

Author(s)

Polette Centellas, Stian Romberg, Ran Tao, Alexander Landauer, Karl Schoch, Huong Giang Nguyen, Gale Holmes, Gery Stafford, Christopher Soles

Residual stresses inevitably develop in thermosetting materials used for semiconductor packaging during the curing process and in service. Understanding the development of these deleterious stresses is necessary for improving predictive models and

Visualizing Shockwave Interactions and Sub-Catastrophic Damage in Materials via Mechanophores

October 7, 2024

Author(s)

Polette Centellas, Kyle Mehringer, Andrew Bowman, Katherine Evans, Parth Vagholkar, Travis Thornell, Liping Huang, Sarah Morgan, Christopher Soles, Yoan Simon, Edwin Chan

Understanding the physical and chemical response of materials to impulsive deformation is crucial for applications ranging from soft robotic locomotion to space exploration to seismology. However, investigating material properties at extreme strain rates

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