U.S. flag

An official website of the United States government

Official websites use .gov
A .gov website belongs to an official government organization in the United States.

Secure .gov websites use HTTPS
A lock ( ) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.

Search Publications by: Polette Centellas (Fed)

Search Title, Abstract, Conference, Citation, Keyword or Author
Displaying 1 - 5 of 5

A Switchable Longitudinal & Shear BLS Microscope for Comprehensive Modulus Imaging of Semiconductor Packaging Materials

June 17, 2026
Author(s)
Andrew Gayle, Sebastian Engmann, Ran Tao, Andrew Korovich, Polette Centellas, Yvonne Gerbig, Christopher Soles, Chris Michaels
Brillouin light scattering (BLS) offers an optical, noncontact, nondestructive method for probing the mechanical properties of next-generation semiconductor packaging materials. In this work, a switchable BLS microscope with both backscattered and off-axis

Controlling the Reaction Pathway to Tune Packaging Epoxy Properties

May 26, 2026
Author(s)
Polette Centellas, Ran Tao, Andrew Korovich, Alexander Landauer, Amanda Forster, Siena Iavarone-Garza, Dante Ribeiro, Huong Giang Nguyen, Jan Obrzut, Stian Romberg, Christopher Soles
Semiconductor packaging demands materials with precisely tuned properties. We demonstrate that the thermoset processing pathway strongly influences functional properties, including moisture and thermomechanical responses. Using a model epoxy system, our

Material Needs and Measurement Challenges for Advanced Semiconductor Packaging: Understanding the Soft Side of Science

August 27, 2025
Author(s)
Ran Tao, Polette Centellas, Stian Romberg, Anthony Kotula, Gale Holmes, Amanda Forster, Christopher Soles, Bob Allen, Edvin Cetegen, William Chen, Jeff Gotro, Mark Poliks
This perspective builds upon insights from the National Institute of Standards and Technology (NIST)-organized workshop, "Materials and Metrology Needs for Advanced Semiconductor Packaging Strategies," held at the 35th annual Electronics Packaging

Advanced Metrology Suite for Linking Residual Stress to Fundamental Properties of Thermoset Packaging Materials

June 26, 2025
Author(s)
Polette Centellas, Stian Romberg, Ran Tao, Alexander Landauer, Karl Schoch, Huong Giang Nguyen, Gale Holmes, Gery Stafford, Christopher Soles
Residual stresses inevitably develop in thermosetting materials used for semiconductor packaging during the curing process and in service. Understanding the development of these deleterious stresses is necessary for improving predictive models and

Visualizing Shockwave Interactions and Sub-Catastrophic Damage in Materials via Mechanophores

October 7, 2024
Author(s)
Polette Centellas, Kyle Mehringer, Andrew Bowman, Katherine Evans, Parth Vagholkar, Travis Thornell, Liping Huang, Sarah Morgan, Christopher Soles, Yoan Simon, Edwin Chan
Understanding the physical and chemical response of materials to impulsive deformation is crucial for applications ranging from soft robotic locomotion to space exploration to seismology. However, investigating material properties at extreme strain rates
Was this page helpful?