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PUBLICATIONS

Advanced Metrology Suite for Linking Residual Stress to Fundamental Properties of Thermoset Packaging Materials

Published

Author(s)

Polette Centellas, Stian Romberg, Ran Tao, Alexander Landauer, Karl Schoch, Huong Giang Nguyen, Gale Holmes, Gery Stafford, Christopher Soles

Abstract

Residual stresses inevitably develop in thermosetting materials used for semiconductor packaging during the curing process and in service. Understanding the development of these deleterious stresses is necessary for improving predictive models and engineering design. Here, we present a suite of metrologies and methodologies, including advanced thermal analysis, rheological characterization, shrinkage, and evolved stress measurements, to link residual stress development with fundamental material properties in a commercial liquid encapsulant.
Proceedings Title
2025 IEEE 75th Electronic Components and Technology Conference (ECTC)
Conference Dates
May 27-30, 2025
Conference Location
Dallas, TX, US
Pub Type
Conferences

Download Paper

https://doi.org/10.1109/ECTC51687.2025.00078
Local Download

Keywords

liquid encapsulant, cure kinetics, rheology, cure shrinkage, residual stress
Polymers, Metrology and Materials characterization

Citation

Centellas, P. , Romberg, S. , Tao, R. , Landauer, A. , Schoch, K. , Nguyen, H. , Holmes, G. , Stafford, G. and Soles, C. (2025), Advanced Metrology Suite for Linking Residual Stress to Fundamental Properties of Thermoset Packaging Materials, 2025 IEEE 75th Electronic Components and Technology Conference (ECTC), Dallas, TX, US, [online], https://doi.org/10.1109/ECTC51687.2025.00078, https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=959548 (Accessed July 25, 2025)

Issues

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Created June 26, 2025, Updated July 2, 2025
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