@conference{1281666,
  author = {Polette Centellas and Stian Romberg and Ran Tao and Alexander Landauer and Karl Schoch and Huong Giang Nguyen and Gale Holmes and Gery Stafford and Christopher Soles},
  title = {Advanced Metrology Suite for Linking Residual Stress to Fundamental Properties of Thermoset Packaging Materials},
  year = {2025},
  month = {2025-06-26 04:06:00},
  publisher = {2025 IEEE 75th Electronic Components and Technology Conference (ECTC), Dallas, TX, US},
  url = {https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=959548},
  doi = {https://doi.org/10.1109/ECTC51687.2025.00078},
  language = {en},
}