TY  - CONF
AU  - Centellas, Polette
AU  - Romberg, Stian
AU  - Tao, Ran
AU  - Landauer, Alexander
AU  - Schoch, Karl
AU  - Nguyen, Huong Giang
AU  - Holmes, Gale
AU  - Stafford, Gery
AU  - Soles, Christopher
C2  - 2025 IEEE 75th Electronic Components and Technology Conference (ECTC), Dallas, TX, US
DA  - 2025-06-26 04:06:00
DO  - https://doi.org/10.1109/ECTC51687.2025.00078
LA  - en
PB  - 2025 IEEE 75th Electronic Components and Technology Conference (ECTC), Dallas, TX, US
PY  - 2025
TI  - Advanced Metrology Suite for Linking Residual Stress to Fundamental Properties of Thermoset Packaging Materials
UR  - https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=959548
ER  -