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Search Publications by: Stian Romberg (Fed)

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Displaying 1 - 3 of 3

Advanced Metrology Suite for Linking Residual Stress to Fundamental Properties of Thermoset Packaging Materials

June 26, 2025
Author(s)
Polette Centellas, Stian Romberg, Ran Tao, Alexander Landauer, Karl Schoch, Huong Giang Nguyen, Gale Holmes, Gery Stafford, Christopher Soles
Residual stresses inevitably develop in thermosetting materials used for semiconductor packaging during the curing process and in service. Understanding the development of these deleterious stresses is necessary for improving predictive models and

Evaluating Models That Predict Epoxy Conversion Using Rheological Properties

April 15, 2024
Author(s)
Stian Romberg, Paul Roberts, Chad R. Snyder, Anthony Kotula
Simultaneous rheology and conversion measurements of neat and composite epoxy resins reveal that conventional models neither accurately nor fully describe the relationship between rheology and conversion. We find that models predicting thermoset conversion
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