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Search Publications by: Stian Romberg (Assoc)

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Displaying 1 - 4 of 4

Material Needs and Measurement Challenges for Advanced Semiconductor Packaging: Understanding the Soft Side of Science

August 27, 2025
Author(s)
Ran Tao, Polette Centellas, Stian Romberg, Anthony Kotula, Gale Holmes, Amanda Forster, Christopher Soles, Bob Allen, Edvin Cetegen, William Chen, Jeff Gotro, Mark Poliks
This perspective builds upon insights from the National Institute of Standards and Technology (NIST)-organized workshop, "Materials and Metrology Needs for Advanced Semiconductor Packaging Strategies," held at the 35th annual Electronics Packaging

Advanced Metrology Suite for Linking Residual Stress to Fundamental Properties of Thermoset Packaging Materials

June 26, 2025
Author(s)
Polette Centellas, Stian Romberg, Ran Tao, Alexander Landauer, Karl Schoch, Huong Giang Nguyen, Gale Holmes, Gery Stafford, Christopher Soles
Residual stresses inevitably develop in thermosetting materials used for semiconductor packaging during the curing process and in service. Understanding the development of these deleterious stresses is necessary for improving predictive models and

Evaluating Models That Predict Epoxy Conversion Using Rheological Properties

April 15, 2024
Author(s)
Stian Romberg, Paul Roberts, Chad R. Snyder, Anthony Kotula
Simultaneous rheology and conversion measurements of neat and composite epoxy resins reveal that conventional models neither accurately nor fully describe the relationship between rheology and conversion. We find that models predicting thermoset conversion
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