July 1, 2001
Author(s)
James R. Baker-Jarvis, Michael D. Janezic, Billy F. Riddle, Christopher L. Holloway, Nicholas Paulter, J Blendell
This is an overview of dielectric measurement methods and metrology on substrate materials used in electronic packaging. These substrates include low-temperature co-fired ceramic, high-temperature co-fired ceramic substrates, printed wiring board, and