Dielectric and Conductor-Loss Characterization and Measurements on Electronic Packaging Materials

Published

July 1, 2001

Author(s)

James R. Baker-Jarvis, Michael D. Janezic, Billy F. Riddle, Christopher L. Holloway, Nicholas Paulter, J Blendell

Abstract

This is an overview of dielectric measurement methods and metrology on substrate materials used in electronic packaging. These substrates include low-temperature co-fired ceramic, high-temperature co-fired ceramic substrates, printed wiring board, and other packaging materials. The most commonly used methods are presented. We place particualr emphasis on methods tha can be used nondestructively either in the laboratory or on the assembly line. We begin with an overview of pertinent electrical properties of substrate materials and conductors. We then describe frequency-dependent metal losses on conductors. We also overview cavity and dielectric resonators, full-sheet resonance. coaxial probe, stripline, and capacitive methods. The frequency reange of applicability and typical uncertainties associated with the methods are summarized. We also present measurement results of many substrate materials.

Citation

Technical Note (NIST TN) - 1520

Report Number

1520

NIST Pub Series

Technical Note (NIST TN)

Pub Type

NIST Pubs

Download Paper

https://doi.org/10.6028/NIST.TN.1520

Local Download

Keywords

dielectric, LTCC, metal loss, microwave, permittivity, PWB, substrate, substrate stripline

Citation

Baker-Jarvis, J. , Janezic, M. , Riddle, B. , Holloway, C. , Paulter, N. and Blendell, J. (2001), Dielectric and Conductor-Loss Characterization and Measurements on Electronic Packaging Materials, Technical Note (NIST TN), National Institute of Standards and Technology, Gaithersburg, MD, [online], https://doi.org/10.6028/NIST.TN.1520, https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=20484 (Accessed April 18, 2024)