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Dielectric and Conductor-Loss Characterization and Measurements on Electronic Packaging Materials



James R. Baker-Jarvis, Michael D. Janezic, Billy F. Riddle, Christopher L. Holloway, Nicholas Paulter, J Blendell


This is an overview of dielectric measurement methods and metrology on substrate materials used in electronic packaging. These substrates include low-temperature co-fired ceramic, high-temperature co-fired ceramic substrates, printed wiring board, and other packaging materials. The most commonly used methods are presented. We place particualr emphasis on methods tha can be used nondestructively either in the laboratory or on the assembly line. We begin with an overview of pertinent electrical properties of substrate materials and conductors. We then describe frequency-dependent metal losses on conductors. We also overview cavity and dielectric resonators, full-sheet resonance. coaxial probe, stripline, and capacitive methods. The frequency reange of applicability and typical uncertainties associated with the methods are summarized. We also present measurement results of many substrate materials.
Technical Note (NIST TN) - 1520
Report Number


dielectric, LTCC, metal loss, microwave, permittivity, PWB, substrate, substrate stripline


Baker-Jarvis, J. , Janezic, M. , Riddle, B. , Holloway, C. , Paulter, N. and Blendell, J. (2001), Dielectric and Conductor-Loss Characterization and Measurements on Electronic Packaging Materials, Technical Note (NIST TN), National Institute of Standards and Technology, Gaithersburg, MD, [online],, (Accessed May 22, 2024)


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Created June 30, 2001, Updated October 12, 2021