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Search Publications by: Christopher L. Holloway (Fed)

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Displaying 376 - 400 of 431

Foreword for Motohisa Kanda's Special Issue

February 1, 2002
Author(s)
Christopher L. Holloway, Perry F. Wilson
This special issue of the IEEE EMC Transactions is in honor of Dr. Motohisa Kanda who passed away on June 12, 2000. Dr. Kanda, known to most of us simply as "Moto," was an important figure within the EMC community and served as Editor of the IEEE EMC

On Determining the Maximum Emissions From Electrically Large Sources

February 1, 2002
Author(s)
Perry F. Wilson, David A. Hill, Christopher L. Holloway
This paper examines the use of measurements of the total radiated power from an arbitrary source, combined with theory-based directivity or quality factor estimates, to accurately predict the maximum electric field radiated by the source either at a line

Transmission-line Parameter Approximation for Digital Simulation

November 1, 2001
Author(s)
Dylan Williams, Christopher L. Holloway
This paper compares closed-form approximations for coplanar waveguide and microstrip transmission-line parameters to accurate measurements and full-wave calculations. We suggest improved approximations and demonstrate the limitations of our proposed and

Meander Delay Line Challenge Problem: A Comparison Using FDTD, FEM and MOM Techniques

August 13, 2001
Author(s)
Alpesh Bhobe, Christopher L. Holloway, Melinda Piket-May
Full wave finite-difference time-domain (FDTD) and a simplified 1D- finite-difference time-domain technique using the multi-conductor transmission line equations are applied to a delay line to determine its propagation characteristics. The output volatge

Dielectric and Conductor-Loss Characterization and Measurements on Electronic Packaging Materials

July 1, 2001
Author(s)
James R. Baker-Jarvis, Michael D. Janezic, Billy F. Riddle, Christopher L. Holloway, Nicholas Paulter, J Blendell
This is an overview of dielectric measurement methods and metrology on substrate materials used in electronic packaging. These substrates include low-temperature co-fired ceramic, high-temperature co-fired ceramic substrates, printed wiring board, and