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Search Publications by: Frank DelRio (Assoc)

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Displaying 76 - 81 of 81

Theta-like specimen to determine tensile strength at the micro-scale

March 10, 2010
Author(s)
Michael S. Gaither, Frank W. DelRio, Richard S. Gates, Edwin R. Fuller, Robert F. Cook
Micro- and nano-electromechanical systems are typically formed via lithographic and etching processes that leave residual surface features, stresses, and chemistry that ultimately control component strength and device reliability. Here, we describe a new

A ROUND ROBIN EXPERIMENT TO PROVIDE PRECISION AND BIAS FOR SEMI MS5: TEST METHOD FOR WAFER BOND STRENGTH MEASUREMENTS USING MICRO-CHEVRON TEST STRUCTURES

December 7, 2009
Author(s)
Richard A. Allen, Winthrop A. Baylies, Paul Langer, Ralph Danzl, Frank W. DelRio, Gavin Horn, Roy Knechtel, Michael Mattes, David T. Read, Sumant Sood, Kevin T. Turner
An international round robin was organized to update SEMI Standard MS5: Test Method for Wafer Bond Strength Measurements using Micro-Chevron Test Structures. Results from the round robin allowed for inclusion of a Precision and Bias statement. The new

Size Measurement of Nanoparticles using Atomic Force Microscopy

October 1, 2009
Author(s)
Jaroslaw Grobelny, Frank W. DelRio, Pradeep Namboodiri, Doo-In Kim, Vincent A. Hackley, Robert F. Cook
In this assay protocol, procedures for dispersing gold nanoparticles on various surfaces such that they are suitable for imaging and height measurement via intermittent contact mode AFM are first described. The procedures for AFM calibration and operation

Elastic and adhesive properties of alkanethiol self-assembled monolayers on gold

March 30, 2009
Author(s)
Frank W. DelRio, Cherno Jaye, Daniel A. Fischer, Robert F. Cook
Elastic and adhesive properties of alkanethiol (CH3(CH2)n 1SH) self-assembled monolayers on gold are investigated by atomic force microscopy and correlated with surface structure via near edge x-ray absorption fine structure spectroscopy. As the chain

A Standard Method for Measuring Wafer Bond Strength for MEMS Applications

December 23, 2008
Author(s)
Richard A. Allen, Janet M. Cassard, Winthrop A. Baylies, David T. Read, George D. Quinn, Frank W. DelRio, Kevin T. Turner, Michael Bernasch, Joerg Bagdahn
A round robin, to provide precision and bias data for SEMI standard MS5-1107, Test Method for Wafer Bond Strength Measurements Using Micro-Chevron Test Structures, in underway. The precision and bias data, combined with experience in applying the test

Mechanical and electrical coupling at metal-insulator-metal nano-scale contacts

May 22, 2008
Author(s)
Doo-In Kim, Pradeep Namboodiri, Frank W. DelRio, Robert F. Cook
Mechanical and electrical coupling at nano-scale metallic contacts was investigated using a conducting-probe atomic force microscope (AFM). The current-voltage responses were non-Ohmic, symmetric about zero bias, with conductance values smaller than the