May 1, 2000
Author(s)
Zachary H. Levine, A R. Kalukin, M Kuhn, S P. Frigo, I McNulty, C C. Retsch, Y Wang, Uwe Arp, Thomas B. Lucatorto, Bruce D. Ravel, Charles S. Tarrio
An integrated circuit interconnect was subject to accelerated-life conditions to induce an electromigration void. The silicon substrate was removed, leaving only the interconnect encased test structure encased in silica. We imaged the sample with 1750 eV