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Search Publications by: Kil-Won Moon ()

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Displaying 26 - 32 of 32

Whisker Formation on Electroplated Sn-Cu

June 1, 2002
Author(s)
Maureen E. Williams, C E. Johnson, Kil-Won Moon, Gery R. Stafford, C A. Handwerker, William J. Boettinger
The probability of whisker growth on as-deposited tin (Sn) electrodeposits has been measured as a function of copper (Cu superscript2+) addition to a commercial bright methanesulfonate electrolyte. Two substrate materials were used: free standing 250 um

The Formation of Whiskers on Electroplated Tin

December 1, 2001
Author(s)
Kil-Won Moon, Maureen E. Williams, C E. Johnson, Gery R. Stafford, C A. Handwerker, William J. Boettinger
ta is presented on the probability of whisker growth on as-grown tin (Sn) electrodeposits as a function of Cu concentration in the electrolye. A commercial bright methanesulfonate electrolyte was employed at 25 degreesC with copper (Cu) concentrations from

Abstracts for the MSEL Assessment Panel, March 2001

January 26, 2001
Author(s)
Leslie E. Smith, Alamgir Karim, Leonid A. Bendersky, C Lu, J J. Scott, Ichiro Takeuchi, Kathleen M. Flynn, Vinod K. Tewary, Davor Balzar, G A. Alers, Stephen E. Russek, Charles C. Han, Haonan Wang, William E. Wallace, Daniel A. Fischer, K Efimenko, Wen-Li Wu, Jan Genzer, Joseph C. Woicik, Thomas H. Gnaeupel-Herold, Henry J. Prask, Charles F. Majkrzak, Norman F. Berk, John G. Barker, Charles J. Glinka, Eric K. Lin, Ward L. Johnson, Paul R. Heyliger, David T. Read, R R. Keller, J Blendell, Grady S. White, Lin-Sien H. Lum, Eric J. Cockayne, Igor Levin, C E. Johnson, Maureen E. Williams, Gery R. Stafford, William J. Boettinger, Kil-Won Moon, Daniel Josell, Daniel Wheeler, Thomas P. Moffat, W H. Huber, Lee J. Richter, Clayton S. Yang, Robert D. Shull, R A. Fry, Robert D. McMichael, William F. Egelhoff Jr., Ursula R. Kattner, James A. Warren, Jonathan E. Guyer, Steven P. Mates, Stephen D. Ridder, Frank S. Biancaniello, D Basak, Jon C. Geist, Kalman D. Migler
Abstracts relating to research and development in the NIST Materials Science and Engineering Laboratory (MSEL) are presented for a poster session to be presented to the 2001 MSEL Assessment Panel.

The Effect of Pb Contamination on the Solidification Behavior of Sn-Bi Solders

January 1, 2001
Author(s)
Kil-Won Moon, William J. Boettinger, Ursula R. Kattner, C A. Handwerker, D J. Lee
This paper presents experimental results and theoretical calculations to evaluate the effects of Pb contamination on the solidification behavior of Sn-x mass Bi alloys (x = 5, 10, and 58 mass %). The pasty (mushy) range, the type of solidification path

Experimental and Thermodynamic Assessment of Sn-Ag-Cu Solder Alloys

October 1, 2000
Author(s)
Kil-Won Moon, William J. Boettinger, Ursula R. Kattner, Frank S. Biancaniello, C A. Handwerker
Sn-rich alloys in the Sn-Ag-Cu system are being studied for their potential as Pb-free solders. Thus, the location of the ternary eutectic involving L, (Sn), Ag 3)Sn and Cu( 6)Sn( 5) phases is of critical interest. Phase diagram data in the Sn-rich corner

The Ternary Eutectic of Sn-Ag-Cu Solder Alloys

September 1, 2000
Author(s)
Kil-Won Moon, William J. Boettinger, Ursula R. Kattner, Frank S. Biancaniello, C A. Handwerker
New measurements using precision thermal analysis and existing experimental data for the Sn-Ag-Cu system are summarized. For Sn-Ag-Cu alloys, the location of the ternary eutectic involving L, Sn, Ag3Sn, and Cu6Sn5 phases in the Sn-rich corner is of