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Search Publications by Thomas P. Moffat

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Displaying 1 - 25 of 144

Simulation of Copper Electrodeposition in Through-Hole Vias

Author(s)
Trevor M. Braun, Daniel Josell, Thomas P. Moffat, Jimmy John
Copper electrodeposition processes for filling metallized through-hole (TH) and through-silicon vias (TSV) depend on selective breakdown of a co-adsorbed

Accelerated Bottom-up Gold Filling of Trenches

Author(s)
Daniel Josell, Maureen E. Williams, Stephen J. Ambrozik, Chen Zhang, Thomas P. Moffat
This work extends previously detailed void-free, bottom-up feature filling in a near-neutral Na3Au(SO3)2 + Na2SO3 electrolyte containing micromolar

Bottom-up Gold Filling of High Aspect Ratio Trenches

Author(s)
Stephen J. Ambrozik, Thomas P. Moffat, Daniel Josell, Chen Zhang, Houxian Miao
This work demonstrates bottom-up superconformal Au filling of trenches as tall as seventeen micrometers. Deposition is conducted in a near-neutral Na3Au(SO3)2 +