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Publications

Search Publications by

Thomas P. Moffat (Fed)

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Displaying 1 - 25 of 148

A Structural Study of Electrodeposited Fe on GaAs(001)

October 12, 2021
Author(s)
Erik B. Svedberg, J Mallett, Leonid A. Bendersky, A G. Roy, William F. Egelhoff Jr., Thomas P. Moffat
The microstructure of Fe films electrodeposited onto n-GaAs(001) from FeCl_(2) and FeSO_(4)-(NH_(4)-(2)SO_(4) electro;ytes was examined by x-ray and electron diffraction. Symmetrical x-ray diffraction from film deposited from chloride solutions indicates a

Artifacts That Could Be Misinterpreted as Ballistic Magnetoresistance

October 12, 2021
Author(s)
William F. Egelhoff Jr., L Gan, Erik B. Svedberg, Cedric J. Powell, Alexander J. Shapiro, Robert McMichael, J Mallett, Thomas P. Moffat, Mark D. Stiles
Theoretical physics suggests that very large magnetoresistance (MR) values might be found in certain magnetic nanocontacts if a magnetic domain wall could be localized in them with a length scale that would allow conduction electrons to transit the wall

Pb electrodeposition on (111)-textured Cu in the Presence and Absence of C1superscript -}: a Combined Oblique Incidence Reflectivity Difference and In-situ AFM Study

October 12, 2021
Author(s)
G Y. Wu, S E. Bae, A A. Gewirth, J Gray, X D. Zhu, Thomas P. Moffat, W Schwarzacher
Oblique incidence reflectivity difference measurements reveal differences in the earliest stages of growth between Pb electrodeposition on (111)-textured Cu in the presence and absence of C1superscript -}. At moderate over potentials, when only 100 mM

Recrystallization Texture and Magnetic Properties of Electrodeposited FePt on Cu(001)

October 12, 2021
Author(s)
Erik B. Svedberg, J Mallett, S Sayan, Alexander J. Shapiro, William F. Egelhoff Jr., Thomas P. Moffat
A near equiatomic FePt fcc alloy has been grown by electrodeposition onto Cu(001). Annealing at 450 (degrees) C results in the onset of a Al fcc to L1(subscript o) fct phase transformation with a dominant FePt(001)(two vertical lines) Cu(002)

High Aspect Ratio Ag Nanowire Mat Electrodes for Electrochemical CO production from CO2

September 13, 2021
Author(s)
David Raciti, Trevor Braun, Brian M. Tackett, Heng Xu, Mutya Cruz, Benjamin Wiley, Thomas P. Moffat
An interconnected network of high-aspect ratio Ag nanowires was pressed against porous gas diffusion layers (both conductive or non-conductive) to use as a gas diffusion electrode (GDE) for the electrochemical reduction of CO2 to CO. Varying the amount of

Self-terminating Electrodeposition of Pt on WC Electrocatalysts

May 10, 2021
Author(s)
Thomas P. Moffat
Self-terminating electrochemical deposition is used to grow Pt nanoparticles on tungsten monocarbide (WC) from a pH 4 electrolyte containing 3 mmol/L K2PtCl4 - 0.5 mol/L NaCl. An unconventional potentiodynamic deposition program is used where nucleation is

Exploring the Limits of Bottom-Up Gold Filling to Fabricate Diffraction Gratings

November 27, 2019
Author(s)
Daniel Josell, Stephen J. Ambrozik, Maureen E. Williams, A E. Hollowell, Christian Arrington, Shinichiro Muramoto, Thomas P. Moffat
Gold deposition on rotating disk electrodes, Bi3+ adsorption on planar Au films and superconformal Au filling of trenches up to 45 m deep are examined in Bi+3-containing Na3Au(SO3)2 electrolytes with pH between 9.5 and 11.5. Higher pH is found to increase

Simulation of Copper Electrodeposition in Through-Hole Vias

October 1, 2019
Author(s)
Trevor M. Braun, Daniel Josell, Thomas P. Moffat, Jimmy John
Copper electrodeposition processes for filling metallized through-hole (TH) and through-silicon vias (TSV) depend on selective breakdown of a co-adsorbed polyether-chloride adlayer within the recessed surface features. In this work, a co-adsorption

Accelerated Bottom-up Gold Filling of Trenches

July 12, 2019
Author(s)
Daniel Josell, Maureen E. Williams, Stephen J. Ambrozik, Chen Zhang, Thomas P. Moffat
This work extends previously detailed void-free, bottom-up feature filling in a near-neutral Na3Au(SO3)2 + Na2SO3 electrolyte containing micromolar concentrations of Bi. Bottom-up electrodeposition in 17 m and 45 m tall trenches is demonstrated using

Bottom-up Gold Filling of High Aspect Ratio Trenches

June 19, 2019
Author(s)
Stephen J. Ambrozik, Thomas P. Moffat, Daniel Josell, Chen Zhang, Houxian Miao
This work demonstrates bottom-up superconformal Au filling of trenches as tall as seventeen micrometers. Deposition is conducted in a near-neutral Na3Au(SO3)2 + Na2SO3 electrolyte containing a micromolar concentration of Bi3+, known to accelerate the Au

Effect of Chloride Concentration on Copper Deposition in Through Silicon Vias

January 18, 2019
Author(s)
Trevor Braun, Daniel Josell, Manoj R. Silva, Thomas P. Moffat
This work examines Cu deposition in low chloride, suppressor containing electrolytes that exhibit a transition from passive to active deposition partway down filling features based on the coupling of suppression breakdown and surface topography. The

Bottom-up Copper Filling of Millimeter Size Through Silicon Vias

January 12, 2019
Author(s)
Daniel Josell, Thomas P. Moffat, Lyle Menk, Andrew Hollowell, M Blain
This work demonstrates void-free Cu filling of millimeter size Through Silicon Vias (mm-TSV) in an acid copper sulfate electrolyte using a combination of a polyoxamine suppressor and chloride, analogous to previous work filling TSV that were an order of

Bottom-Up Copper Filling of Large Scale Through Silicon Vias for MEMS Technology

November 2, 2018
Author(s)
Daniel Josell, Thomas P. Moffat, L A. Menk, E Baca, M Blain, A Smith, Jason Dominguez, J McClain, P D. Yeh, A E. Hollowell
An electrodeposition process for void-free bottom-up filling of sub-millimeter scale through silicon vias (TSVs) with Cu is detailed. The 600 m deep and nominally 125 m diameter metallized vias were filled with Cu in less than 7 hours under

Mapping Electron Transfer at MoS2 using Scanning Electrochemical Microscopy

October 29, 2018
Author(s)
Nicole L. Ritzert, Veronika Szalai, Thomas P. Moffat
Understanding the role of macroscopic and atomic defects in the interfacial electron transfer properties of layered transition metal dichalcogenides is important in optimizing their performance in energy conversion and electronic devices. Means of

SEIRAS Study of Chloride Mediated Polyether Adsorption on Cu

August 31, 2018
Author(s)
Thomas P. Moffat, Daniel Josell, Lee J. Richter
Surface enhanced infrared absorption spectroscopy (SEIRAS) was used to examine the co- adsorption of a selection of polyethers with Cl- under conditions relevant to superconformal Cu electrodeposition in CuSO4-H2SO4 electrolytes. In 0.1 mol/L H2SO4 a

Bottom-up Filling of Damascene Trenches with Gold in a Sulfite Electrolyte

August 19, 2018
Author(s)
Daniel Josell, Thomas P. Moffat
Superconformal Au deposition is demonstrated in a Na3Au(SO3)2 + Na2SO3 electrolyte including Bi3+. Micromolar additions of the Bi3+ to the electrolyte catalyze the reduction of Au(SO3)23- based on hysteretic voltammetry and rising chronoamperometric

Superconformal Nickel Deposition in Through Silicon Vias: Experiment and Prediction

May 16, 2018
Author(s)
Trevor Braun, Daniel Josell, Thomas P. Moffat, Hyo Jong Lee, SH Kim
This work examines the filling of Through Silicon Vias (TSV) by Ni deposition from a NiSO4 + NiCl2 + H3BO3 electrolyte containing a branched polyethyleneimine suppressor previously. Feature filling occurs through the coupling of transport limited

Performance and failure modes of Si anodes patterned with thin-film Ni catalyst islands for water oxidation

March 6, 2018
Author(s)
Ke Sun, Nicole L. Ritzert, Jimmy John, Haiyan Tan, William G. Hale, Jingjing Jiang, Kimberly M. Papadantonakis, Thomas P. Moffat, Bruce S. Brunschwig, Nathan S. Lewis
Silicon photoanodes patterned with Ni thin film catalyst islands exhibited stable oxygen evolution for over 240 h of continuous operation in 1.0 mol L-1 KOH(aq) under simulated sunlight conditions. Buried-junction np+-Si(111) photoanodes with an 18.0%