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Search Publications by: Thomas P. Moffat (Fed)

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Displaying 1 - 25 of 165

Extreme Bottom-up Gold Filling of High Aspect Ratio Features

February 27, 2023
Daniel Josell, Thomas P. Moffat
Where copper interconnects fabricated using superconformal electrodeposition processes have enabled dramatic advances in microelectronics over the last quarter century, gold filled gratings fabricated using superconformal 〖Bi〗^(3+)-mediated bottom-up

Mechanism of Bismuth Stimulated Bottom-up Gold Feature Filling

December 30, 2022
Daniel Josell, Trevor Braun, Thomas P. Moffat
The mechanism that underlies 〖Bi〗^(3+)-stimulated extreme bottom-up Au filling of trenches and vias in slightly alkaline 〖Na〗_3 Au(〖SO〗_3 )_2+〖Na〗_2 〖SO〗_3 electrolytes is explored. The remarkable void-free feature filling and self-passivation behavior

Magnetic Characterization of Electrodeposited Pt1-xNix Alloy Films: Influence of Deposition Potential and the Presence of Boric Acid

September 21, 2022
Eric Rus, Eduardo De Lima Correa, Evan Groopman, Todd Williamson, Hussein Hijazi, Leila Kasaei, Leonard Feldman, Cindi L. Dennis, Thomas P. Moffat
Pt1-xNix (x = 0.25 to 0.92) thin films were examined for possible application as temperature sensing magnetic reporters. The alloys were prepared by charge-limited potentiostatic electrodeposition from aqueous chloride-based solutions in the presence and

Potentiometric Rotating Ring Disk Electrode (RRDE) Study of Interfacial pH during CO2 Reduction and H2 Generation in Neutral and Weakly Acidic Media

April 21, 2022
Thomas P. Moffat, Nicole Ritzert, David Raciti, Brian Tackett, Nicholas Brady
Electrocatalytic reduction of CO2 to CO in aqueous media offers an important path to more sustainable carbon utilization. Optimization of this process relies on a detailed understanding of the dynamics of boundary layer chemistry, e.g., pH, adjacent to the

Effect of Chloride on Microstructure in Cu Filled Microscale Through Silicon Vias

November 2, 2021
Daniel Josell, Thomas P. Moffat, Trevor Braun
The microstructure of copper filled through silicon vias deposited in a CuSO4 + H2SO4 electrolyte containing micromolar concentrations of deposition rate suppressing poloxamine and chloride additives is explored using electron backscatter diffraction

A Structural Study of Electrodeposited Fe on GaAs(001)

October 12, 2021
Erik B. Svedberg, J Mallett, Leonid A. Bendersky, A G. Roy, William F. Egelhoff Jr., Thomas P. Moffat
The microstructure of Fe films electrodeposited onto n-GaAs(001) from FeCl_(2) and FeSO_(4)-(NH_(4)-(2)SO_(4) electro;ytes was examined by x-ray and electron diffraction. Symmetrical x-ray diffraction from film deposited from chloride solutions indicates a

Artifacts That Could Be Misinterpreted as Ballistic Magnetoresistance

October 12, 2021
William F. Egelhoff Jr., L Gan, Erik B. Svedberg, Cedric J. Powell, Alexander J. Shapiro, Robert McMichael, J Mallett, Thomas P. Moffat, Mark D. Stiles
Theoretical physics suggests that very large magnetoresistance (MR) values might be found in certain magnetic nanocontacts if a magnetic domain wall could be localized in them with a length scale that would allow conduction electrons to transit the wall

Pb electrodeposition on (111)-textured Cu in the Presence and Absence of C1superscript -}: a Combined Oblique Incidence Reflectivity Difference and In-situ AFM Study

October 12, 2021
G Y. Wu, S E. Bae, A A. Gewirth, J Gray, X D. Zhu, Thomas P. Moffat, W Schwarzacher
Oblique incidence reflectivity difference measurements reveal differences in the earliest stages of growth between Pb electrodeposition on (111)-textured Cu in the presence and absence of C1superscript -}. At moderate over potentials, when only 100 mM

Recrystallization Texture and Magnetic Properties of Electrodeposited FePt on Cu(001)

October 12, 2021
Erik B. Svedberg, J Mallett, S Sayan, Alexander J. Shapiro, William F. Egelhoff Jr., Thomas P. Moffat
A near equiatomic FePt fcc alloy has been grown by electrodeposition onto Cu(001). Annealing at 450 (degrees) C results in the onset of a Al fcc to L1(subscript o) fct phase transformation with a dominant FePt(001) (two vertical lines) Cu(002)

High Aspect Ratio Ag Nanowire Mat Electrodes for Electrochemical CO production from CO2

September 13, 2021
David Raciti, Trevor Braun, Brian M. Tackett, Heng Xu, Mutya Cruz, Benjamin Wiley, Thomas P. Moffat
An interconnected network of high-aspect ratio Ag nanowires was pressed against porous gas diffusion layers (both conductive or non-conductive) to use as a gas diffusion electrode (GDE) for the electrochemical reduction of CO2 to CO. Varying the amount of

Additives for Superconformal Gold Feature Filling

May 11, 2021
Daniel Josell, Thomas P. Moffat
An overview of the effect of additives on Au electrodeposition from Na3Au(SO3)2 based electrolytes is presented with an emphasis on filling of fully metallized recessed surface features such as trenches and vias. The impact of heavy metals additives Tl+

Self-terminating Electrodeposition of Pt on WC Electrocatalysts

May 10, 2021
Thomas P. Moffat
Self-terminating electrochemical deposition is used to grow Pt nanoparticles on tungsten monocarbide (WC) from a pH 4 electrolyte containing 3 mmol/L K2PtCl4 - 0.5 mol/L NaCl. An unconventional potentiodynamic deposition program is used where nucleation is

Simulation of Copper Electrodeposition in Millimeter Size Through-Silicon Vias

December 16, 2020
Trevor Braun, Daniel Josell, Thomas P. Moffat
Computational predictions of copper deposition in millimeter size through-silicon vias (mm-TSV) are presented based on localized breakdown of a co-adsorbed polyether-chloride suppressor layer. The model builds upon previous work on localized Cu deposition

Pushing the Limits of Bottom-Up Gold Filling for X-Ray Grating Interferometry

September 30, 2020
Daniel Josell, Thomas P. Moffat, Z Shi, K Jefimovs, L Romano, J. Vila-Comamala
The application of superconformal Bi-catalyzed Au electrodeposition for void-free filling of recessed trenches in X-ray gratings used in phase contrast imaging is detailed. Filling of trenches with aspect ratio (height divided by its width) up to 55 is