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Displaying 1 - 25 of 80

Effect of Vacancy Creation and Annihilation on Grain Boundary Motion

January 15, 2020
Author(s)
Geoffrey B. McFadden, William J. Boettinger, Yuri Mishin
The interaction of vacancies with grain boundaries (GBs) is involved in many processes occurring in materials, including radiation damage healing and diffusional creep. We analyze a model describing a set of processes occurring at a GB in the presence of a

John Werner Cahn

September 15, 2019
Author(s)
William J. Boettinger, C A. Handwerker, Frank W. Gayle
John Werner Cahn, retired Senior Fellow of the National Institute of Standards and Technology (NIST), died in Seattle, WA on March 14, 2016 at age 88. After distinguished careers at General Electric in Schenectady, N.Y. (1954-1964) and at MIT (1964-1978)

Solidification of Ni-Re Peritectic Alloys

February 4, 2019
Author(s)
William J. Boettinger, Dale E. Newbury, Nicholas W. Ritchie, Maureen E. Williams, Ursula R. Kattner, Eric Lass, Kil-Won Moon, Michael B. Katz
Differential thermal analysis (DTA) and microstructural and microprobe measurements of DTA and as-cast Ni-Re alloys with compositions between 0.20 and 0.44 mass fraction Re provide information to resolve differences in previously published Ni-Re phase

Interdiffusion in the Ni-Re System: Evaluation of Uncertainties

June 23, 2017
Author(s)
William J. Boettinger, Maureen E. Williams, Kil-Won Moon
Diffusion couple experiments between Ni and Re at 1200°C and 1350°C were performed. These experiments established the limits of the two-phase FCC + HCP region. No intermediate phase was observed at these temperatures. Composition dependent interdiffusion

Diffusion in FCC Co-Al-W Alloys at 900 degree C and 1000 degree C

August 17, 2016
Author(s)
Kil-Won Moon, Carelyn E. Campbell, Maureen E. Williams, William J. Boettinger
Diffusion couple experiments between various Co-rich face centered cubic alloys in the Co-W-Al ternary system have been conducted at 900 degree C and 1000 degree C. Diffusion coefficients have been extracted for the Co-W binary and for ternary alloys at

On the Solidification of Multicomponent Alloys

February 1, 2016
Author(s)
William J. Boettinger
Various topics taken from the author's research portfolio that involve multicomponent alloy solidification will be reviewed. Topics include: ternary eutectic solidification and Scheil-Gulliver paths in ternary systems. A case study of the solidification of

Sharp interface model of creep deformation in crystalline solids

June 30, 2015
Author(s)
Yuri Mishin, Geoffrey B. McFadden, Robert F. Sekerka, William J. Boettinger
We present a rigorous irreversible thermodynamics treatment of creep deformation of solid mate- rials with interfaces described as geometric surfaces capable of vacancy generation and absorption and moving under the influence of local thermodynamic forces

Solidification

December 19, 2014
Author(s)
William J. Boettinger, Dilip K. Banerjee
In this chapter, we give a general view of the formation of the solid from its melt. This process is generally driven by the extraction of heat from the melt but fluid flow has a major influence on solidification. Thus an early section deals with transport

Irreversible thermodynamics of creep in crystalline solids

November 15, 2013
Author(s)
Yuri Mishin, James A. Warren, Robert F. Sekerka, William J. Boettinger
We develop an irreversible thermodynamics framework for the description of creep deformation in crystalline solids by mechanisms that involve vacancy diffusion and lattice site generation and annihilation. The material undergoing the creep deformation is

A diffuse-interface Model of Reactive Wetting with Intermetallic Formation

May 1, 2012
Author(s)
Walter Villaneuva, William J. Boettinger, Geoffrey B. McFadden, James A. Warren
A diffuse-interface model of reactive wetting with intermetallic formation is developed that incorporates fluid flow, phase change, and solute diffusion. The model is based on the total molar Gibbs energy of a ternary system with four phases. Numerical

Effect of Phase Change and Solute Diffusion on Spreading on a Dissolving Substrate

October 1, 2010
Author(s)
Walter Villanueva, William J. Boettinger, James A. Warren, Gustav Amberg
Dissolutive wetting is investigated numerically using a diffuse-interface model that incorporates fluid flow, solute diffusion, and phase change. A range of materials parameters are investigated that: 1) permits recovery of the hydrodynamic limit by

Examination of Multiphase (Zr,Ti)(V,Cr,Mn,Ni)2 Ni-MH Electrode Alloys. Part 2: Solid-State Transformation of the Interdendritic B2 Phase Phase

August 15, 2010
Author(s)
Leonid A. Bendersky, Ke Wang, William J. Boettinger, Dale E. Newbury, K. Young, B. Chao
Multi-component Zr-Ti-Ni-TM (TM=V, Cr, Mn and Co) cast alloys intended for use as negative electrodes in Ni metal hydride batteries were studied to determine the solidification microstructure and solidification path in the Part I of this paper. Part II of

Solidification of a heterogeneous Multiphase Laves-based Hydrogen Storage Alloy

August 15, 2010
Author(s)
William J. Boettinger, Dale E. Newbury, Ke Wang, Leonid A. Bendersky, Chun Chiu, Ursula R. Kattner, K. Young, B. Chao
The solidification microstructure of a nine-element Zr-Ni based AB(sub 2) type C14/C15 Laves hydrogen storage alloy is determined. The selected composition represents a class of alloys being examined for usage as a metal hydride electrode in nickel metal

Modeling Reactive Wetting when Inertial Effects are Dominant

June 30, 2010
Author(s)
Daniel Wheeler, James A. Warren, William J. Boettinger
Recent experimental studies of molten metal droplets wetting and spreading on high temperature reactive substrates have established that the majority of triple-line motion occurs when inertial effects are dominant. In light of these studies, this paper

Thermodynamic model of hydride formation and dissolution in spherical particles

June 30, 2010
Author(s)
Yuri Mishin, William J. Boettinger
A model of hydride formation and dissolution has been proposed for a single spherical nano-particle and for a colletion of such particles with a given size distribution. The phase transformation strain gives rise to an elastic barrier of the transformation

A Multicomponent and Multiphase Model of Reactive Wetting

June 4, 2010
Author(s)
Walter Villanueva, William J. Boettinger, Geoffrey B. McFadden, James A. Warren
A diffuse-interface model of reactive wetting with intermetallic formation is presented. The model incorporates fluid flow, solute diffusion, and phase change that are based on the total molar Gibbs energy of a ternary system with four phases. Numerical

Atomistic simulation of hillock growth

May 15, 2010
Author(s)
Timofey Frolov, William J. Boettinger, Yuri Mishin
The goal of this paper is to explore mechanisms of hillock and whisker growth in stressed poly-crystalline films by molecular dynamics simulations. Our stress-free model consists of three grains and a triple line aligned perpendicular to a free surface

Diffusion Parameters and Growth Mechanism of Phases in the Cu-Sn System

April 15, 2010
Author(s)
William J. Boettinger, C Ghosh, A Paul
The tracer diffusion coefficients of the elements as well as the integrated interdiffusion coefficients are measured for the Cu(sub3)Sn and Cu(sub6)Sn(Sub5) intermetallic compounds using incremental diffusion couples. The activation energies are determined

Whisker Formation in Pb-Free Surface Finishes

February 2, 2010
Author(s)
Gery R. Stafford, Maureen E. Williams, Jae W. Shin, Kil-Won Moon, William J. Boettinger, Carlos R. Beauchamp
Tin(Sn)-lead(Pb) alloys have been used extensively for surface finishing of electronic components in part because Pb was found to be effective in retarding Sn whisker growth in electrodeposits. Altough whiskers appear to be a local response to the

Bending of a Bimetallic Beam due to the Kirkendall Effect

January 1, 2010
Author(s)
William J. Boettinger, Geoffrey B. McFadden
The time dependent bending of single phase and two phase bimetal strips due to interdiffusion is computed. The model couples simple beam theory and diffusion, the bending being due to the creation and /annihilation of vacancies necessitated by unequal

Examination of Sn Electrodeposit on a Substrate Not Forming Intermetallic

October 16, 2008
Author(s)
Maureen E. Williams, Kil-Won Moon, William J. Boettinger, Daniel Josell
Intermetallic compound (IMC) formation at the interface between the tin (Sn) plating and the copper (Cu) substrate of electronic components has been thought to produce compressive stress in Sn electrodeposits and cause the growth of Sn whiskers. To