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Displaying 49826 - 49850 of 73969

Fundamental Constants, QED, and the Proton Form Factor

September 1, 1999
Author(s)
Peter J. Mohr, Barry N. Taylor
Most of the fundamental constants are obtained by the comparison of the results of critical experiments and theoretical expressions for these results. Many of the theoretical expressions are based on quantum electrodynamics (QED), so the consistency of the

Global Model for Predicting the Burning Rates of Liquid Pool Fires (NISTIR 6381)

September 1, 1999
Author(s)
Anthony P. Hamins, Jiann C. Yang, Takashi Kashiwagi
A global model is presented which predicts the mass burning flux for pool fires consuming liquid fuels in a quiescent environment. the model assumes constant bulk properties such as flame temperature, soot volume fraction, and species concentration. The

Incoporating Process Planning into Conceptual Design

September 1, 1999
Author(s)
Shaw C. Feng, Gordon A. Shaw, Walter W. Nederbragt, Serge Kaing, Ram D. Sriram
This paper describes recent developments in the Design and Process Planning Integration (DPPI) project at the National Institute of Standards and Technology (NIST). The project addresses the need for improved communication between design and process

Information Modeling: From Design to Implementation

September 1, 1999
Author(s)
Yung-Tsun T. Lee
Today's manufacturing industry greatly relies on computer technology to support activities throughout a product's life cycle. Effective and efficient information sharing and exchange among computer systems have been critical issues. Formal information

Isochoric Heat Capacity of Heavy Water at Subcritical and Supercritical Conditions

September 1, 1999
Author(s)
B A. Mursalov, Ilmutdin Abdulagatov, V I. Dvoryanchikov, A N. Kamalov, S B. Kiselev
The heat capacity of heavy water was measured in the temperature range from 294 to 746 K and at densities between 52 and 1105 kgm -3 using a high-temperature, high-pressure adiabatic calorimeter. The measurements were performed at 14 liquid and 9 vapor

Lead-Free Solders: A Change in the Electronics Infrastructure

September 1, 1999
Author(s)
C A. Handwerker
The infrastructure for electronics assembly has, from its infancy, been based on tin-lead solder (Sn/Pb), a mixture of tin and lead in the ratio of approximately 63/37 (by weight) that melts at 183 C. Since legislation to eliminate lead from electronics

Leakage and Counting Errors in a Seven-junction Electron Pump

September 1, 1999
Author(s)
Richard L. Kautz, Mark W. Keller, John M. Martinis
Leakage and counting errors are explored experimentally in a well-characterized seven-junction electron pump and compared with predictions of the orthodox theory, including cotunneling.

Multimode Fiber Transceiver Launch Distribution: Results of an Industry Round Robin

September 1, 1999
Author(s)
John B. Schlager, M. J. Hackert, M. Pepeljugoski, Mike Murphy, R. Neumann, J. Gwinn
An industry round robin conducted by the Telecommunications Industry Association FO-2.2 Task Group on the Modal Dependence of Bandwidth demonstrates good inter-laboratory agreement for measurements of transceiver encircled flux.
Displaying 49826 - 49850 of 73969
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