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Search Publications

NIST Authors in Bold

Displaying 47851 - 47875 of 73697

Polarization Correlations in Pulsed VCSELs

May 1, 2000
Author(s)
D. R. Shelly, T. W. Garrison, M. Beck, David H. Christensen
We have measured the correlations between the two orthogonal linearly polarized outputs of a pulsed vertical-cavity, surface-emitting laser and found them to be dependent on the number of lasing modes.

Presenting Search Results: Design, Visualization, and Evaluation

May 1, 2000
Author(s)
John V. Cugini
A number of projects within the National Institute of Standards and Technology (NIST) have addressed the visual presentation and evaluation of search results. Within the design space for this problem, we distinguish between the logical structure imposed on

Recent Developments in BIPM Voltage Standard Comparisons

May 1, 2000
Author(s)
D. Reymann, Thomas J. Witt, P. Vrabcek, Yi-hua D. Tang, Clark A. Hamilton, A. S. Katkov, Blaise Jeanneret, O. Power
The BIPM carries out a number of comparisons of DC voltage standards with National Metrology Institutes. These take the form of on-site comparisons of Josephson standards or bilateral comparisons using traveling standards based on Zener diodes. This paper

Reconstruction and Preliminary Tests of the NIST Electronic Kilogram Experiment

May 1, 2000
Author(s)
Richard L. Steiner, David B. Newell, J. Schwarz, Edwin R. Williams, Ruimin Liu
The NIST electronic kilogram experiment is being completely rebuilt into a vaccum chamber within a specially designed laboratory room. Major renovations include reference mass positioning equipment, structural alignment flexures, and a redesigned inductive

Report on the CCEM Comparison of 10 pF Capacitance Standards

May 1, 2000
Author(s)
Anne-Marie Jeffery
This paper describes the recent Comite Consultatif d'Electricite et Magnetisme (CCEM) comparison of 10 pF capacitors. The comparison of electrical standards between the regional metrology organization (RMOs) will establish the relationship of the

RF Material Characterization Using a Large-Diameter (76.8 mm) Coaxial Air Line

May 1, 2000
Author(s)
Chriss A. Jones, John H. Grosvenor Jr, Claude Weil
We report the development of a 76.84 mm (3.025 in) diameter coaxial air line system whose purpose is to measure the dielectric and magnetic properties of bulk dielectric and ferrite materials over a frequency range of approximately 0.3 - 1500 MHZ. We

Role of Competitive Interactions in Growth Rate Trends of Subtilsin s88 Crystals

May 1, 2000
Author(s)
D Asthagirl, A Lenhoff, David Travis Gallagher
An orthorhombic crystal form of subtilisin BPN' variant s88 exhibits a systematic variation in growth rates of its three unique faces, resulting in pronounced variations in crystal morphology as a function of the ionic strength. We have sought to explain

Rotating-Wheel Braille Display for Continuous Refreshable Braille

May 1, 2000
Author(s)
John W. Roberts, Oliver T. Slattery, D W. Kardos
The increasingly pervasive influence of information technology on daily life makes accessibility a higher priority than ever before. Millions of blind and visually impaired people in the US (and far higher numbers worldwide) need some form of non-visual

Shear Strength of High-Strength Concrete Walls and Deep Beams

May 1, 2000
Author(s)
Dat Duthinh
In the last 30 years, the compressive strength of concrete that can be produced reliably in the field has more than doubled, from 35 MPa (5000 psi) to 85 MPa (12 000 psi). Strengths as high as 140 MPa (20 000 psi) can be achieved in the laboratory and, on

Spot Test Kits for Detecting Lead in Household Paint: A Laboratory Evaluation

May 1, 2000
Author(s)
Walter J. Rossiter Jr, M Vangel, M E. McKnight, G Dewalt
A laboratory study was conducted to determine the reliability of spot test kits for detecting the presence of lead in household paint when tests were conducted by certified lead inspectors or risk assessors. Reagent solutions were applied to paint

Standardization in Technology-Based Markets

May 1, 2000
Author(s)
Gregory C. Tassey
The complexity of modern technology, especially its system character, has led to an increase the number and variety of standards that affect a single industry or market. Standards affect the R&D, production, and market penetration stages of economic

Superconducting Transition-Edge Bolometer Arrays for Ultra-Low Power Radiometry

May 1, 2000
Author(s)
Erich N. Grossman, James A. Chervenak, Kent D. Irwin, Carl D. Reintsema
A new generation of ultra-low power bolometer arrays is under development for low background infrared astronomy. This paper describes radiometric measurements on such bolometers using a cryogenic blackbody source with accurately calculable throughput

Tele-Metrology and Advanced Ultrasonic Flow Metering (Updated Version)

May 1, 2000
Author(s)
Pedro I. Espina, Tsyh Tyan Yeh, P I. Rothfleisch, S A. Osella
In an effort to expand the range of the national standards, NIST is experimenting with tele-metrology concepts to annex flow calibration facilities throughout the U.S. An essential part of this approach is the use of sensors capable of assessing the

The Infrared Spectrum and Internal Rotation Barrier in HF--BF 3

May 1, 2000
Author(s)
K Nauta, R E. Miller, Gerald T. Fraser, Walter J. Lafferty
The rotationally resolved infrared spectrum of the HF stretch fundamental in combination with one quantum of internal rotationexcitation has been observed for the HF--BF 3 complex using a color-center-laser optothermal molecular-beam spectrometer.This

The TREC-8 Question Answering Track Evaluation

May 1, 2000
Author(s)
Ellen M. Voorhees, D M. Tice
The TREC-8 Question Answering track was the first large-scale evaluation of systems that return answers, as opposed to lists of documents, in response to a question. As a first evaluation, it is important to examine the evaluation methodology itself to

Thermally Induced Deformations in a Flip-Chip HDI Substrate

May 1, 2000
Author(s)
Elizabeth S. Drexler
At issue was the thermomechanical response of microvias in a high-density interconnect (HDI) substrate. The HDI package containing microvias, blind vias, solder bumps, and line traces was thermally cycled five times between -55 and 125 C in a scanning
Displaying 47851 - 47875 of 73697
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