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Displaying 32276 - 32300 of 74129

Buckling Modes of Elastic Thin Films on Elastic Substrates

January 1, 2007
Author(s)
Haixia Mei, Jun Y. Chung, Honghui Yo, Christopher Stafford, Rui Huang
Subject to compression, a thin elastic film bonded to an elastic substrate can buckle. Two buckling modes have been observed. On a stiff substrate, the film buckles when it is partly delaminated from the substrate, resulting in localized buckle patterns

Calibrated Overlay Wafer Standard

January 1, 2007
Author(s)
Michael T. Stocker, Richard M. Silver, Ravikiran Attota, Jay S. Jun
This document describes the physical characteristics of Standard Reference Material SRM 5000, provides guidance for its use in calibrating overlay (OL) tools, and gives information and precautions concerning its care and handling.Standard Reference

Cell Morphology and Migration Linked to Substrate Rigidity

January 1, 2007
Author(s)
Yong Ni, Martin Chiang
A mathematical model, based on thermodynamics, was developed to demonstrate the substrate mechanics influences the cell morphology and migration. The mechanisms by which substrate rigidity are translated into cell morphological changes and cell movement
Displaying 32276 - 32300 of 74129